Sealed Heat Dissipation Cover for Dustproof Circuit Board Cooling
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Solution Overview
Problem
Server devices face issues with dust accumulation affecting usability and reduced service life due to external airflow-based heat dissipation, which also complicates the mounting of thermally conductive channels.
Innovation Solution
A control device with a heat dissipation cover featuring thermally conductive strips and fins, integrated with a fan to generate airflow parallel to the fins, ensuring sealing and dustproof performance while efficiently conducting heat away from the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external airflow is used for heat dissipation, then heat dissipation function is improved, but dust particles are brought into the device affecting usability and service life
Solution Approach 1:
The device is divided into separate sealed modules (circuit board assembly, heat dissipation assembly, fan assembly) that can be independently manufactured and assembled. The heat dissipation fins are segmented and arranged in specific patterns to optimize airflow while maintaining sealing integrity.
Solution Approach 2:
A sealed housing structure acts as an intermediary barrier between the internal circuit board and the external environment. The housing includes sealed interfaces and dust-proof designs that prevent dust ingress while allowing controlled airflow for heat dissipation through designated pathways.
2Temperature
If multiple thermally conductive channels are designed inside to conduct heat, then heat dissipation efficiency is improved, but mounting becomes very troublesome
Solution Approach 1:
Multiple thermally conductive channels are merged into an integrated heat dissipation structure that is pre-assembled and pre-tested as a single module. The thermally conductive channels are combined with the housing and heat dissipation fins to form a unified assembly that simplifies installation by reducing the number of separate mounting operations required.
Solution Approach 2:
The thermally conductive channels and heat dissipation structure are pre-assembled and pre-configured during manufacturing before being installed in the final device. This preliminary assembly allows for quality control and testing to be performed on the heat dissipation module independently, simplifying the final installation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation and dustproofing, maintaining device usability and extending service life by preventing dust ingress and optimizing heat transfer.
Implementation Method 1
a thermally conductive strip, a first surface of which abutting against the circuit board, and a second surface of which abutting against the heat dissipation cover plate
Implementation Method 2
a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board
Implementation Method 3
a fan, arranged in the through groove and used for generating an airflow parallel to planes of the heat dissipation fins
Data Source
AI summary
The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.