Power Converter Cooling Layout for Fast Semiconductor Overheat Detection

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Solution Overview

Problem

Existing power conversion devices face issues with delayed cooling abnormality detection due to temperature detectors being unable to follow steep temperature changes, leading to potential semiconductor element breakage and increased device costs or size when multiple detectors are used.

Innovation Solution

A power conversion device design where the inverter and rectifying circuits are positioned above a refrigerant channel, with a single temperature detector placed adjacent to both circuits, allowing for rapid detection of cooling abnormalities regardless of temperature change speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature detector is attached across a metal plate on the cooler to avoid thermal interference, then measurement precision is improved, but the temperature detector cannot follow steep temperature changes, resulting in delayed cooling abnormality detection

Engineering Contradiction:

Improverefrigerant temperature detection accuracyVSAvoidcooling abnormality detection time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The patent introduces a thermal conductor as an intermediary element that directly contacts both the semiconductor element and the temperature detector. This thermal conductor acts as a mediator to transfer heat rapidly from the semiconductor element to the temperature detector, enabling the detector to follow steep temperature changes while maintaining accurate temperature measurement capability

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the temperature detection function by separating the temperature detector from direct contact with the semiconductor element. Instead, the detector contacts a dedicated thermal conductor element that is thermally coupled to the semiconductor element, allowing the detector to be optimized for measurement precision while the thermal conductor handles rapid heat transfer

Inventive Principle:

Principle #1Segmentation

2Reliability

If multiple temperature detectors are provided for each semiconductor element to ensure protection, then reliability is improved, but device cost and size increase

Engineering Contradiction:

Improvesemiconductor element protectionVSAvoidnumber of temperature detectors

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent makes the single temperature detector universal by having it monitor multiple semiconductor elements through the thermal conductor mechanism. The temperature detector serves multiple functions: detecting temperature of different semiconductor elements, identifying cooling abnormalities, and providing protection for various semiconductor components, thereby reducing the total number of detectors needed

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the temperature detection function for multiple semiconductor elements into a single temperature detector system. By combining the thermal conduction paths from multiple semiconductor elements to a common temperature detector, the system achieves reliable monitoring of all semiconductor elements while reducing component count and simplifying the overall device structure

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables efficient protection of semiconductor elements by detecting cooling abnormalities swiftly, reducing device size and cost by using a single detector.

Implementation Method 1

a cooler that cools the semiconductor elements, and a refrigerant is caused to circulate on an inner side of the cooler, thereby cooling the semiconductor elements disposed in the cooler

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

a refrigerant is caused to circulate on an inner side of the cooler, thereby cooling the semiconductor elements

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

a temperature detector that detects a temperature of the semiconductor elements configuring the inverter circuit and the semiconductor elements configuring the rectifying circuit

Methodology Applied

Scientific EffectTemperature detection: Thermal Radiation

Data Source

PatentUS12476547B2Power conversion device with semiconductor temperature protection

Publication Date: 2025.11.18 MITSUBISHI ELECTRIC CORP

AI summary

The power conversion device includes a transformer having primary and secondary windings, an inverter circuit that carries out a supply of power to the primary winding, a rectifying circuit that rectifies power from the secondary winding, a cooler that cools semiconductor elements configuring the inverter circuit and semiconductor elements configuring the rectifying circuit, and a temperature detector that detects a temperature of the semiconductor elements configuring the inverter circuit and the semiconductor elements configuring the rectifying circuit. The cooler has a refrigerant channel along which a refrigerant is caused to circulate, the inverter circuit, the rectifying circuit, and the temperature detector are disposed above the refrigerant channel, and the temperature detector is disposed neighboring at least either one of the inverter circuit or the rectifying circuit.