Integrated Cooling Loop for Compact Power Electronics Enclosures
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Solution Overview
Problem
Existing cooling systems for power electronic components in compact enclosures face challenges in managing thermal management efficiently within spatial constraints, often compromising cooling efficiency or system compactness, and fail to address issues like space constraints, cooling efficiency, and ambient temperature control.
Innovation Solution
A cooling system comprising a heat exchanger, coolant lines, a pump, a fan, and a duct assembly is integrated within an energy container to efficiently manage thermal loads, using a closed-loop coolant circulation and forced air convection to cool transformers and maintain optimal operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air and liquid cooling systems are used, then cooling capacity is improved, but system volume and space requirements increase
Solution Approach 1:
The patent combines air cooling and liquid cooling into a single integrated cooling system. The liquid cooling loop cools power electronic components while the air cooling loop cools transformers, and both loops share common components (pump, heat exchanger, control system) to reduce overall system volume. This merging allows adequate cooling capacity while maintaining a compact footprint suitable for space-constrained applications.
Solution Approach 2:
The cooling system is designed with multi-functionality where a single system provides cooling for multiple different components (power electronic modules and transformers) using different cooling mechanisms. The pump serves both liquid coolant circulation and the system can operate in different modes (air cooling, liquid cooling, or both simultaneously), reducing the need for separate dedicated cooling systems for each component type.
2Volume of stationary object
If cooling system components are reduced for compactness, then system volume decreases, but cooling efficiency deteriorates
Solution Approach 1:
The patent applies different cooling methods to different components based on their specific thermal requirements. Power electronic components receive liquid cooling for high-density heat removal, while transformers receive air cooling. This localized approach to cooling quality ensures each component is cooled efficiently according to its needs without over-engineering the entire system, maintaining high cooling efficiency while minimizing system volume.
3Volume of stationary object
If compact enclosure is used, then portability is improved, but thermal accumulation increases
Solution Approach 1:
The patent segments the internal enclosure space into distinct thermal zones with dedicated cooling loops for different components. The liquid cooling loop handles heat from power electronics while the air cooling loop handles transformer heat, and exhaust air is directed away from heat-generating components. This segmentation prevents thermal accumulation and hot spots within the compact enclosure, maintaining effective cooling despite limited space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures efficient thermal management, extends component lifespan, and maintains a compact form factor by optimizing space utilization and reducing the need for extensive cooling infrastructure, while adapting to varying thermal and environmental conditions.
Implementation Method 1
a pump configured to distribute coolant throughout the coolant lines
Implementation Method 2
a heat exchanger, coolant lines disposed within the heat exchanger and throughout the power electronic system
Implementation Method 3
a fan configured for air intake through the heat exchanger to cool the coolant lines
Implementation Method 4
a fan configured for air intake through the heat exchanger to cool the coolant lines
Implementation Method 5
a duct assembly configured to direct the air intake from the fan towards the power electronic system
Data Source
AI summary
Disclosed is a cooling system for a power electronic system comprising a heat exchanger, coolant lines disposed within the heat exchanger and throughout the power electronic system, a pump configured to distribute coolant throughout the coolant lines, a fan configured for air intake through the heat exchanger to cool the coolant lines, and a duct assembly configured to direct the air intake from the fan towards the power electronic system.