Power Module Heat Sink Bonding for Compact Thermal Management
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Solution Overview
Problem
Existing power modules require significant installation space and inefficient cooling due to multiple thermal interfaces and suboptimal heat dissipation.
Innovation Solution
A power module design with at least two power units, each comprising a power semiconductor and a substrate, directly connected to a common heat sink via a materially bonded connection, with a gaseous coolant flow parallel to the heat sink surface, and power units arranged transversely offset to optimize cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power modules use multiple thermal interfaces and discrete structural forms, then ease of manufacture is improved, but installation space increases and cooling efficiency deteriorates
Solution Approach 1:
The patent merges multiple power units onto a single heat sink, eliminating the need for separate thermal interfaces for each power unit. This consolidation reduces the overall installation space while maintaining manufacturing feasibility through modular power unit design that can be integrated onto one heat sink surface.
Solution Approach 2:
The patent arranges power units in a transverse offset configuration relative to the coolant flow direction, utilizing spatial arrangement in multiple dimensions. This dimensional optimization allows efficient heat dissipation across the heat sink surface while minimizing the footprint area required for the entire power module.
2Ease of manufacture
If power modules use multiple thermal interfaces, then ease of manufacture is improved, but cooling efficiency deteriorates
Solution Approach 1:
The patent combines multiple power units onto a single heat sink, eliminating intermediate thermal interfaces between power units and the heat sink. This direct thermal coupling reduces thermal resistance and improves cooling efficiency while maintaining manufacturing feasibility through standardized power unit designs.
Solution Approach 2:
The patent removes unnecessary thermal interfaces and intermediate mounting structures from the power module assembly. By extracting these redundant components, the design achieves more direct thermal pathways from power units to the heat sink, thereby improving cooling efficiency without compromising ease of manufacture.
3Ease of operation
If power units are arranged in traditional configurations, then ease of assembly is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent employs a transverse offset arrangement of power units relative to the coolant flow direction, utilizing multi-dimensional spatial optimization. This configuration enhances heat dissipation efficiency by optimizing thermal contact with the heat sink while maintaining straightforward assembly procedures through modular design.
Solution Approach 2:
The patent optimizes the local arrangement of power units on the heat sink surface, positioning them to maximize thermal contact and heat dissipation efficiency. This localized optimization ensures that each power unit is strategically placed for effective cooling while maintaining overall assembly simplicity through standardized mounting patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces installation space and enhances cooling efficiency through improved thermal coupling and heat splay, achieving cost-effective and reliable operation.
Implementation Method 1
a gaseous coolant flows in a direction of coolant flow, wherein the direction of coolant flow runs substantially parallel to the surface of the heat sink
Implementation Method 2
the substrates of the at least three power units are in each case directly connected in a materially bonded manner to a surface of a common heat sink
Data Source
AI summary
A power module includes at least two power units. Each power unit includes at least one power semiconductor and a substrate. In order to reduce the installation space required for the power module and to improve cooling, the at least one power semiconductor is connected, in particular in a materially bonded manner, to the substrate. The substrates of the at least two power units are each directly connected in a materially bonded manner to a surface of a common heat sink. A power converter having at least one power module is also disclosed.