Power Supply Airflow Guide Layout for Transformer Cooling

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Solution Overview

Problem

Existing power supply devices face challenges in effectively dissipating heat from high-power transformers, leading to elevated temperatures that exceed application requirements, and existing solutions like larger fans increase energy consumption and noise.

Innovation Solution

A power supply device with airflow guide members that redirect airflow to enhance heat dissipation by increasing air velocity and flow quantity through auxiliary air channels, utilizing a circuit board, fans, and airflow guide members to form multiple channels that converge airflow directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heatsink is disposed on PWB of transformer and heat conducting grease is used, then heat dissipation is improved, but manufacturing cost increases and assembly time is extended

Engineering Contradiction:
Improvetransformer temperatureVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The invention extracts the heatsink component and replaces it with airflow guide members that redirect existing airflow to improve heat dissipation. This eliminates the need for additional heat conducting materials and simplifies assembly, directly addressing the cost and complexity issues while maintaining temperature control.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The airflow guide members act as intermediaries that modify the existing airflow path to enhance heat dissipation from the transformer. Instead of adding thermal interface materials, the system uses modified airflow as the heat transfer medium, reducing material costs and assembly complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heatsink with heat conducting grease is used, then heat dissipation is improved, but assembly time and processing complexity increase

Engineering Contradiction:
Improvetransformer temperatureVSAvoidassembly time
Core Design Contradiction:
TemperatureVSLoss of time

Solution Approach 1:

The invention removes the heatsink and heat conducting grease from the assembly process, replacing them with airflow guide members that work with the existing cooling system. This eliminates time-consuming assembly steps while achieving the same heat dissipation goal through airflow optimization.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The airflow guide members enable the existing airflow system to self-adjust and optimize heat dissipation without requiring additional assembly steps. The system uses its own airflow resource more effectively, eliminating the need for complex thermal interface assembly.

Inventive Principle:
Principle #25Self-service

3Temperature

If fan with larger flow is selected to increase heat dissipation, then temperature is reduced, but energy consumption and noise increase

Engineering Contradiction:
Improvetransformer temperatureVSAvoidenergy consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The invention applies local quality modification by introducing airflow guide members at specific locations to redirect and concentrate cooling airflow precisely where heat dissipation is needed. This localized optimization improves heat dissipation efficiency without requiring increased overall airflow, thus avoiding higher energy consumption and noise.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention changes the airflow distribution parameters rather than increasing the total airflow volume. By modifying how airflow is directed and distributed through the airflow guide members, the system achieves better heat dissipation with the same fan power, avoiding increased energy consumption and noise.

Inventive Principle:
Principle #35Parameter changes

4Temperature

If fan with larger flow is selected, then heat dissipation capability is improved, but system noise increases

Engineering Contradiction:
Improvetransformer temperatureVSAvoidsystem noise
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The airflow guide members create localized high-velocity cooling zones directed at the transformer, improving heat dissipation efficiency without requiring the fan to operate at higher overall flow rates. This maintains lower noise levels while achieving the desired cooling effect at the critical heat-generating component.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention changes the airflow velocity distribution and direction parameters through the guide members, concentrating cooling effectiveness where needed without increasing the overall fan output. This maintains lower operating noise while achieving improved heat dissipation through optimized airflow patterns.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces transformer and switch temperatures by 12-13°C, achieves cost savings by reducing material costs, and improves working efficiency by simplifying assembly.

Implementation Method 1

a fan is disposed on the first side of the circuit board, wherein the fan is used to provide an air-cooled airflow for heat dissipation

Methodology Applied
Scientific EffectAir cooling: Convection

Implementation Method 2

the first airflow guide member, the second airflow guide member and the first heating element form a first auxiliary air channel; wherein a direction of the first auxiliary air channel is the same as the airflow direction, and the power supply device increases an air velocity and an air flow quantity through the first auxiliary air channel

Methodology Applied
Scientific EffectFluid flow: Convection

Implementation Method 3

a first heating element is mounted on the circuit board and disposed close to the second side of the circuit board

Methodology Applied
Scientific EffectHeat generation: Joule Heating

Data Source

PatentUS12610499B2Power supply with airflow guide members
Publication Date: 2026.04.21 DELTA ELECTRONICS (SHANGHAI) CO LTD
  • US12610499B2 patent drawing
  • US12610499B2 patent drawing
  • US12610499B2 patent drawing

AI summary

A power supply with airflow guide members includes a circuit board having a first side and a second side opposite to each other and at least mounted with a first heating element disposed close to the second side, a fan disposed on the first side of the circuit board, a first airflow guide member and a second airflow guide member, the first airflow guide member disposed in parallel to the first heating element, the second airflow guide member at least partially disposed above the first heating element, and adjacent to the first airflow guide member, the first airflow guide member, the second airflow guide member and the first heating element form a first auxiliary air channel, a direction of the first auxiliary air channel is the same as a airflow direction. The power supply with airflow guide members can enhance heat dissipation capability.