Circuit Chip Connecting Device Using Vacuum Adsorption and Vibration
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Solution Overview
Problem
Existing methods for connecting circuit chips to substrates, such as those used in flexible display devices, face challenges in maintaining stable electrical connections due to external forces and require high pressure and temperature, which increases processing costs and complexity.
Innovation Solution
A connecting device with a main body, vibration part, and intake part that adsorbs the circuit chip using vacuum openings, allowing for vibration at specific frequencies to securely connect the chip to a substrate without the need for anisotropic conductive films, reducing processing costs and improving connection stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive film is used to provide stable electrical connection, then connection stability is improved, but processing cost and complexity increase
Solution Approach 1:
The patent removes the anisotropic conductive film from the connection structure, replacing it with a direct mechanical and electrical connection between the circuit chip bump and substrate pad through the connecting device. This extraction eliminates the need for additional conductive materials and simplifies the overall connection structure while maintaining stable electrical connection.
Solution Approach 2:
The connecting device serves as an intermediary tool that enables direct connection between the circuit chip and substrate without requiring anisotropic conductive film. The device includes a holding portion that secures the circuit chip and a pressing portion that applies controlled force to establish the bump-to-pad connection, thereby mediating the connection process without complex materials.
2Strength
If high pressure and temperature are applied for connection, then connection strength is improved, but processing cost and complexity increase
Solution Approach 1:
The connecting device incorporates a vibration generation portion that applies mechanical vibration to the circuit chip during the connection process. This vibration facilitates proper alignment and contact between the bump and pad, enabling strong electrical connection without requiring high pressure or temperature conditions, thereby simplifying the processing requirements.
Solution Approach 2:
The holding portion of the connecting device performs preliminary action by securely holding and positioning the circuit chip before the actual connection occurs. This preliminary positioning ensures proper alignment with the substrate pad, preventing the need for high pressure or temperature to compensate for misalignment during connection.
3Reliability
If anisotropic conductive film is used, then electrical connection is maintained under external forces, but processing time and cost increase
Solution Approach 1:
The connecting device is segmented into distinct functional portions: a holding portion for securing the circuit chip, a pressing portion for applying connection force, and a vibration generation portion for facilitating alignment. This segmentation allows each component to perform its specific function efficiently, reducing overall processing time while achieving reliable connection that can withstand external forces.
Solution Approach 2:
The vibration generation portion applies mechanical vibration during the connection process to ensure proper contact and alignment between the bump and pad. This vibration helps establish a robust connection quickly, eliminating the need for prolonged processing time associated with anisotropic conductive film application and curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and stable electrical connections between circuit chips and substrates, reducing processing time and costs while maintaining connection integrity even under external forces, enhancing the reliability of flexible display devices.
Implementation Method 1
an intake part coupled with the first and second openings to adsorb the circuit chip to the main body
Implementation Method 2
a vibration part on the main body, the vibration part being configured to vibrate the main body
Data Source
AI summary
A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.