Printed Circuit Assembling TRIZ Cases

An angled intermediate circuit board connects a plug connector strip to a primary circuit board via soldered pins.

A holder system uses a flexible carrier to peel and attach heat sinks, preventing warpage caused by nozzle suction.

A laser beam ablates the organic solderability preservative layer to expose copper for reliable wire bonding.

A motor vehicle exterior light uses a curable connecting material to attach LEDs directly to an elastically restorable film support structure.

An inclined supporting component integrates mechanical support and electrical conductors to enable automatic surface mounted device assembly.

A flexible wiring substrate protruding part absorbs optical layer steps to narrow air bubble regions in input devices.

Protrusions on the connection electrode form a groove that holds the conductor part, preventing squashing and shifting during soldering.

Segmented mounting and connection electrodes eliminate solder masks, reducing manufacturing complexity while preventing vibration noise transmission.

Nickel barriers block electromigration reactions to prevent copper consumption and void formation in solder bump interconnects.

Exposed ESL control patterns on dielectric layers reduce impedance peaks and suppress voltage noise without increasing mounting space.

Lead frame solder dams prevent low-melting alloy formation by blocking molten solder flow, ensuring joint durability.

Segmented prepregs with a UV curable resin layer fill gaps around electrical components, preventing damage from lamination pressure and temperature.

A planar integrated circuit package structure uses a single metal layer to enable smaller form factors.

Aligning a tapering supply device with slanted cavity sidewalls eliminates dead corners and ensures homogeneous medium distribution.

Fan-shaped non-conductive zones prevent bent terminals from damaging conductive patterns, resolving reliability and manufacturing precision trade-offs.

Selective laser texturing modifies copper foil surface roughness to enhance substrate adhesion.

A connecting device adsorbs circuit chips via vacuum openings while vibrating the main body to align bumps with substrate pads.

Pre-defined mold receptacles orient conductor elements to eliminate measurement steps and increase production speed.

Hermetic glass covers bond to substrates prior to laser trimming, preventing post-trimming drift from oxidation and packaging stresses.

Direct conductive ink printing creates complex 3D antenna geometries, eliminating costly laser direct structuring and specialized thermoplastic substrates.

A mounting structure bonds a substrate and raised electronic component using multiple stacked reinforcing resin layers along the component side.

Floating dummy conductors in sparse electrode regions distribute ultrasonic bonding force, preventing semiconductor chip tilt and breakage.

A debonding film layer separates adhesive bonds to allow rework of heat management components without damaging the integrated circuit.

A conductive post with varying width portions enables precise electrical connections across stacked semiconductor substrates.

A silicon interposer integrates through-silicon vias to establish dense vertical electrical pathways between die structures and substrates.

Pre-forms positioning holes in adhesive coated copper to align electronic elements, controlling material shrinkage and preventing damage during pressing.

A segmented heat distributor bonded to a PCB provides lateral thermal transport, reducing LED temperature by 8.4 Kelvin and extending lifespan.

Shield layer with metal and dielectric substrate provides electromagnetic shielding for signal electrodes, reducing crosstalk between adjacent channels.

Removable intermediate layers on reflow oven chambers capture flux contaminants, preventing board contamination and reducing maintenance downtime.

Dual microcontrollers route signals between a central module and peripherals, enabling adaptability without increasing manufacturing complexity or cost.

Calculating solder amounts across the squeegee length to reduce rolling operations and ensure uniform distribution.

Reinforcement patterns on cavity bottoms strengthen printed wiring boards, preventing cracking in ultra-thin designs.

A stainless steel base material with cavities supports embedded electronic devices between metal and insulating layers to form reusable circuit substrates.

An electronic device module positions a power substrate below the main device inside a sealed cavity to minimize height while shielding electromagnetic waves.

Laser-assisted bonding localizes heat to reflow bumps, minimizing thermal expansion and shrinkage that cause cracks in the circuit board.

Opposing end walls with lead guides stack axial through-hole components vertically, eliminating hand soldering and secondary mechanical support requirements.

A circuit board assembly employs a daughter board cavity to enclose mother board components, reducing keep-out zones and improving packaging efficiency.

A feedthrough assembly uses laser bonding to hermetically seal external contacts on a non-conductive substrate.

Magnetic bus coatings redirect common mode currents to dampen electromagnetic interference without external filters.

A printed circuit board recess positions the coaxial cable outer casing, resolving hand soldering inaccuracies and providing strain relief.

Flexible lock structure detects half-engaged assembly states to prevent foreign matter entry and ensure accurate housing alignment.

Solvent-free silicone conductive ink prints fine circuit patterns directly onto metal electrodes.

Alignment posts and biasing devices position the integrated circuit package within the socket, preventing contact damage during manual handling.

A bridge device routes signals between a packaged integrated circuit and a substrate via dedicated interconnect structures.

Composite terminal blocks resolve creeping discharge and thermal runaway risks in high-voltage inverters.

A wiring board design uses asymmetric buildup structures to integrate inductor devices directly into the substrate layers.

A component reception order determining device optimizes the sequence of electronic circuit components to minimize mounting head movement between feeders and substrates.

Segmenting stencils by measured warpage parameters improves joint reliability without increasing assembly complexity.

A junction substrate with matched thermal expansion coefficient reduces stress on flip-chip bumps, improving airtightness and heat dissipation.