Interposer Electrode Design for Vibration Noise Reduction
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Solution Overview
Problem
Existing methods for mounting multilayer ceramic capacitors on circuit boards often result in vibration due to mechanical strain, leading to noise issues and increased manufacturing costs, particularly when using interposers with complex electrode arrangements and solder masks.
Innovation Solution
A flat-plate-shaped insulating substrate with strategically positioned upper and lower surface electrodes and connection electrodes that limit solder spread to prevent vibration transmission, allowing for secure bonding and reduced noise through controlled solder adherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer with complex electrode arrangement and solder mask is used to prevent vibration, then vibration noise is reduced, but manufacturing cost and device complexity increase
Solution Approach 1:
The interposer structure is segmented into distinct functional zones: mounting electrodes for securing the interposer to the circuit board, connection electrodes for electrical connectivity, and insulating regions. This segmentation simplifies the overall design by assigning specific functions to specific areas, reducing the complexity of the electrode arrangement while maintaining vibration prevention capabilities.
Solution Approach 2:
The solder mask layer is extracted and eliminated from the interposer structure. Instead of using a solder mask to control solder flow and prevent vibration, the invention relies on the inherent mechanical properties of the interposer substrate and its electrode configuration. This removal simplifies manufacturing processes and reduces device complexity while still achieving vibration noise reduction.
2Ease of manufacture
If solder mask is formed on side surfaces of component substrate to prevent solder rise, then solder adhesion is controlled, but manufacturing cost increases
Solution Approach 1:
The solder mask is completely removed from the interposer structure. Solder adhesion control is achieved through the geometric configuration of the mounting electrodes and connection electrodes, along with the mechanical restraint provided by the interposer substrate itself. This eliminates the need for additional solder mask formation processes, reducing manufacturing complexity and cost.
Solution Approach 2:
Different regions of the interposer have different properties optimized for their specific functions. The mounting electrodes provide mechanical restraint and electrical connectivity, while the connection electrodes provide electrical pathways. This local differentiation of properties achieves solder adhesion control without requiring a uniform solder mask across the entire component substrate.
3Reliability
If interposer size is increased to accommodate complex electrode arrangements, then electrical connectivity is improved, but component size and manufacturing cost increase
Solution Approach 1:
The electrode system is segmented into mounting electrodes positioned at specific locations for mechanical and electrical attachment, and connection electrodes positioned for electrical connectivity. This segmentation allows for optimized electrical pathways without requiring a uniform increase in interposer size, as electrodes are placed only where functionally necessary.
Solution Approach 2:
The mounting electrodes serve dual functions: providing mechanical restraint to prevent vibration and providing electrical connectivity to the circuit board. This multi-functionality reduces the need for separate dedicated connection structures, thereby reducing the overall interposer area while maintaining reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces or prevents vibration noise while maintaining strong bonding and low profile, simplifying design and manufacturing, and ensuring mounting strength similar to traditional methods without increasing the component's size.
Implementation Method 1
the lower surface electrode is joined to a mounting electrode of the circuit board
Implementation Method 2
the upper surface electrode is joined to an outer electrode of a chip component
Data Source
AI summary
In an electronic component, upper surface electrodes are located on one main surface of an insulating substrate of an interposer on which a multilayer ceramic capacitor is mounted. The insulating substrate has substantially the same shape as that of the multilayer ceramic capacitor, viewed from a direction perpendicular or substantially perpendicular to the main surface, and has the multilayer ceramic capacitor mounted thereon so that the length direction of the multilayer ceramic capacitor substantially coincides with the length direction of the insulating substrate. The insulating substrate includes cutouts that include connection electrodes, respectively, and that are located at the four corners viewed from the direction perpendicular or substantially perpendicular to the main surface. The upper surface electrodes on the one main surface are connected via the connection electrodes to lower surface electrodes, respectively, that are located on the other main surface and are connected to a circuit board.