Stacked Reinforcing Resin Layers for Tall Electronic Component Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional mounting structures for large electronic components, such as capacitors or transformers, face insufficient reinforcing effects due to stress concentration at joints between reinforcing resin and substrates, leading to inadequate bonding strength and increased manufacturing costs.
Innovation Solution
A mounting structure featuring multiple reinforcing resin layers stacked vertically along the sides of large electronic components, with layers spaced at intervals and decreasing in dimension or thickness as they rise from the substrate, to absorb and distribute stress effectively, while minimizing the use of reinforcing material and avoiding the need for substrate modifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If reinforcing resin is vertically applied along the side of a large electronic component to reinforce bonding, then the reinforcing effect is sufficient for low-profile components, but stress concentrates at the joint between the reinforcing resin and substrate, causing separation for large, thick components
Solution Approach 1:
The reinforcing resin is divided into multiple layers stacked in the height direction, creating intermediate joints that distribute stress throughout the structure rather than concentrating it at a single location. This segmentation of the reinforcing resin into discrete layers prevents stress concentration at the substrate interface.
Solution Approach 2:
The reinforcing structure transitions from a single vertical application to a multi-layer stacked configuration in the height direction. This dimensional approach distributes the reinforcing function across multiple levels, reducing stress concentration at any single joint while maintaining overall bonding strength.
2Strength
If a reinforcing component is fabricated to fit the electronic component shape with elastic protrusions, then sufficient reinforcing effect is achieved, but manufacturing cost and number of manufacturing steps increase
Solution Approach 1:
The stacked reinforcing resin layers serve multiple functions simultaneously: they provide mechanical reinforcement, distribute stress across multiple joints, and can be applied using standard dispensing equipment. This universal approach eliminates the need for custom-fitted reinforcing components while achieving superior bonding performance.
Solution Approach 2:
The reinforcing resin layers are applied as simple, inexpensive material deposits rather than requiring fabrication of durable, custom-fitted reinforcing components. This approach reduces manufacturing cost and complexity while achieving the necessary reinforcing effect through proper layer stacking.
3Strength
If a tying band is used to mechanically fix the electronic component, then sufficient reinforcing effect is achieved, but holes must be formed on the substrate, limiting design flexibility
Solution Approach 1:
The stacked reinforcing resin layers act as an intermediary bonding mechanism between the electronic component and substrate, eliminating the need for mechanical fasteners that require substrate modifications. This intermediary approach maintains design flexibility while achieving sufficient reinforcing strength through distributed stress across multiple resin layers.
Data Source
AI summary
A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.