Inclined SMD Mounting Component for Automatic Assembly
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Solution Overview
Problem
Existing methods for mounting surface mounted devices (SMDs) on substrates, such as LEDs, are inefficient and costly due to the difficulty in achieving the necessary inclination for directional light emission, often requiring manual labor and increasing production costs.
Innovation Solution
A supporting component with a wedge-shaped body made of isolating material and conductors for forming electrical contact between the substrate and SMD electrodes, allowing for automatic and efficient mounting of SMDs at a desired inclination, enabling simultaneous electrical connection and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a bent metal plate stand is used to provide inclination for the LED, then the desired inclination is achieved, but the mounting process becomes manual and complex
Solution Approach 1:
The patent combines the mechanical support function and electrical connection function into a single integrated component. The supporting component includes both the inclined body structure and conductors that provide electrical contact, eliminating the need for separate mounting and wiring operations. This merging of functions directly resolves the contradiction by maintaining the inclination capability while simplifying the mounting process to be fully automatic.
Solution Approach 2:
The supporting component is designed to perform multiple functions simultaneously: it provides mechanical support with the desired inclination, establishes electrical contact through integrated conductors, and enables automatic mounting. This multi-functionality allows a single component to replace what would otherwise require multiple separate components and operations, thereby reducing mounting complexity while preserving the inclination feature.
2Manufacturing precision
If manual mounting is used to achieve proper inclination, then mounting precision is improved, but productivity decreases
Solution Approach 1:
The desired inclination is built into the supporting component itself during manufacturing, rather than requiring adjustment during mounting. The conductors are pre-positioned and fixed to the inclined body, so that when the component is mounted automatically, the inclination and electrical connections are already correctly configured. This preliminary preparation enables both high precision and high speed in the mounting process.
Solution Approach 2:
The supporting component is designed to self-align and self-connect during automatic mounting. The inclined body and integrated conductors work together to automatically establish both mechanical support and electrical contact in a single operation, eliminating the need for manual positioning or adjustment. This self-service capability enables fully automatic mounting while maintaining precise inclination.
3Adaptability or versatility
If separate components are used for support and electrical contact, then design flexibility is improved, but device complexity increases
Solution Approach 1:
The patent merges the support structure and electrical connection elements into a single integrated supporting component. The body provides mechanical support with inclination, while conductors are fixed to the body to provide electrical contact. This combination reduces the number of separate components needed while maintaining the flexibility to achieve desired inclination angles and electrical connections through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates quick, automatic, and cost-effective mounting of SMDs on substrates while ensuring proper inclination and electrical contact, with enhanced heat management for high-power devices, suitable for mass production and applications like automotive lighting.
Implementation Method 1
a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15)
Implementation Method 2
a ceramic core (2) often has a suitable thermal conductivity which avoids problems related to heat emission from the SMD that is supported by the supporting component (1)
Data Source
AI summary
A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.