Reusable Circuit Substrate Manufacturing via Stainless Steel Core Separation
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Solution Overview
Problem
Conventional circuit substrates with embedded electronic devices result in non-reusable core substrates, increased material usage, and longer manufacturing processes, leading to higher costs and thicker final products.
Innovation Solution
A manufacturing method for circuit substrates using a stainless steel base material with cavities, where electronic devices are embedded between metal layers and insulating layers, allowing for separation into two distinct substrates, utilizing a stainless steel core layer and adhesive layers for structural stability and reusability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional core substrate is used to embed electronic devices, then the circuit substrate can be manufactured, but the core substrate becomes non-reusable and the final product is thicker
Solution Approach 1:
The manufacturing process is segmented into two independent stages: first forming circuit layers on one surface of the core substrate, then forming separate circuit layers on the other surface. This allows the core substrate to be reused for multiple devices while reducing the need for thick individual substrates, as each surface can support independent circuit formations.
Solution Approach 2:
The core substrate is designed to serve multiple functions: it acts as a structural base, a platform for embedding electronic devices, and a reusable manufacturing tool. By forming circuit layers on both surfaces, the same core substrate can produce multiple circuit substrates, increasing its utility and reusability across different manufacturing cycles.
2Productivity
If a conventional core substrate is used to embed electronic devices, then the circuit substrate can be manufactured, but more materials are required and the manufacturing process is longer
Solution Approach 1:
The patent merges the manufacturing of multiple circuit substrates into a single process by forming circuit layers on both surfaces of one core substrate simultaneously. This combining approach reduces material consumption by reusing the core substrate and decreases manufacturing time by parallelizing the production of multiple devices from a single base.
Solution Approach 2:
Instead of discarding the core substrate after a single use, the invention recovers and reuses it for manufacturing additional circuit substrates. The core substrate is retained as a reusable platform, allowing multiple electronic devices to be embedded and processed without requiring new substrate materials for each device, thereby reducing overall material consumption.
3Ease of manufacture
If a conventional core substrate is used to embed electronic devices, then the circuit substrate can be manufactured, but the manufacturing cost is higher
Solution Approach 1:
The core substrate maintains continuous useful action throughout the manufacturing process by serving as an active platform for multiple device fabrications. Rather than being discarded after one use, it continuously supports the formation of circuit layers and embedding of electronic devices across multiple manufacturing cycles, reducing both time and cost per unit produced.
Data Source
AI summary
A circuit board including an electronic device and a manufacturing method of the circuit board are provided. The manufacturing method includes: providing a stainless steel base material including a first surface and a second surface opposite to each other, at least one first cavity located at the first surface and at least one second cavity located at the second surface; respectively forming a first and a second metal layers on the stainless steel base material; respectively disposing at least one first and at least one second electronic devices in the first and the second cavities; respectively forming a first and a second insulating layers on the first and the second surfaces; respectively forming a first and a second circuit structures on the first and the second insulating layers, separating the stainless steel base material, the first and the second metal layers to form two separate circuit substrates including electronic devices.