Mold Receptacles for PCB Conductor Positioning

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Solution Overview

Problem

The existing method for producing printed circuit boards with conductor elements is inefficient due to the need for repeated measurement procedures, which reduces productivity in mass production.

Innovation Solution

A method involving a mold with defined receptacles for conductor elements, allowing precise orientation and connection to an electrically conductive sheet-like element without separate measurement, followed by embedding in insulating material, thereby eliminating unnecessary measurement steps and enhancing productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If repeated measurement procedures are performed to ensure manufacturing precision of conductor elements and connection points, then manufacturing precision is improved, but productivity deteriorates due to process delays

Engineering Contradiction:
Improvepositioning precision of conductor elementsVSAvoidproduction speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The mold defines receptacles for conductor elements in advance, pre-establishing precise positions and orientations before the conductor elements are placed. This preliminary definition of geometric constraints eliminates the need for post-placement measurement and adjustment, resolving the contradiction by ensuring precision through pre-configured fixtures rather than post-process verification.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The mold acts as an intermediary device that mediates between the conductor elements and the final circuit board assembly. By providing pre-defined receptacles with precise geometric relationships, the mold serves as a reference framework that automatically ensures manufacturing precision without requiring additional measurement procedures, thus maintaining both precision and productivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If separate measurement procedures are performed for each conductor element to establish connection positions, then manufacturing precision is improved, but device complexity increases due to multiple measurement steps

Engineering Contradiction:
Improveconnection point positioning accuracyVSAvoidnumber of measurement procedures
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The mold serves multiple functions simultaneously: it defines the positions of conductor elements, establishes the orientations of conductor elements, and determines the locations of connection points on the circuit board. This multi-functionality eliminates the need for separate measurement procedures for each parameter, reducing device complexity while maintaining manufacturing precision through a single integrated reference framework.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the functions of multiple measurement and positioning operations into a single mold structure. The receptacles in the mold combine position definition, orientation control, and connection point localization into one unified system, eliminating the need for separate measurement procedures and reducing overall process complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11395411B2Method for producing a printed circuit board using a mould for conductor elements
Publication Date: 2022.07.19 JUMATECH
  • US11395411B2 patent drawing
  • US11395411B2 patent drawing
  • US11395411B2 patent drawing

AI summary

A method is provided for producing a printed circuit board including at least one conductor element, which extends between connection points in the printed circuit board. In order to increase the productivity of a known method for producing a printed circuit board including at least one conductor element, which extends between connection points in the printed circuit board, the method comprises the following steps: Step A: providing a mold having at least one receptacle for a conductor element; Step B: arranging a conductor element in the receptacle of the mold; Step C: connecting the conductor element arranged in the receptacle of the mold to an electrically conductive sheetlike element at positions of the intended connection points; Step D: embedding the conductor element, which is connected to the electrically conductive sheetlike element, into insulating material; and Step E: working out the connection points from the electrically conductive sheetlike element.