Embedded Circuit Board Alignment via Pre-Formed Positioning Holes
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Solution Overview
Problem
Traditional methods for embedding electronic elements in flexible printed circuit boards face challenges such as material shrinkage control and alignment accuracy, leading to potential damage and functional issues due to the thinness of the materials.
Innovation Solution
A method involving adhesive coated copper layers with positioning holes and a semi-cured film, where electronic elements are embedded and secured using a plating layer to ensure accurate positioning and electrical connection, while controlling the thickness and flatness of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional press-fit embedding method is used, then electronic elements can be embedded in the substrate, but material shrinkage is difficult to control resulting in poor alignment accuracy
Solution Approach 1:
The patent applies preliminary action by pre-forming positioning holes in the copper foil layer before embedding the electronic elements. These positioning holes serve as alignment guides that prevent material shrinkage from affecting the final position of the embedded elements, thereby ensuring accurate alignment without requiring precise control of material shrinkage during the embedding process
2Reliability
If traditional press-fit embedding method is used, then electronic elements can be embedded in the substrate, but the electronic elements may be damaged during pressing due to the thinness of the material
Solution Approach 1:
The patent applies beforehand cushioning by embedding the electronic elements into grooves that are pre-formed in the copper foil layer. These grooves act as cushioning structures that absorb and distribute the pressing force during the embedding process, preventing direct concentrated pressure on the thin electronic elements and thereby avoiding damage while still enabling secure embedding
3Length of stationary object
If electronic elements are embedded to reduce thickness, then the thickness of the circuit board is reduced, but the embedding process becomes more complex with traditional methods
Solution Approach 1:
The patent applies merging by integrating multiple functions into a single embedding process. The copper foil layer serves simultaneously as the substrate for embedding, the structural support layer, and the conductive layer. The positioning holes and grooves are formed in the copper foil itself, eliminating the need for separate preparation layers and simplifying the overall embedding process while achieving thickness reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the alignment and protection of electronic elements, reducing material damage and improving the thickness and functionality of the embedded circuit board.
Implementation Method 1
an adhesive layer, wherein the adhesive layer is used to bond the copper foil to the flexible substrate
Implementation Method 2
a plating layer, wherein the plating layer is used to electrically connect the electrodes to the copper foil
Data Source
AI summary
A method of manufacturing an embedded circuit board includes: a first adhesive coated copper is provided, which includes a first copper layer pre-formed with at least two first positioning holes and a first adhesive layer formed on a surface of the first copper layer; at least one first electronic element are adhered to the first adhesive layer, electrodes of the first electronic element face their corresponding first positioning hole; a second adhesive coated copper and a semi-cured film are provided, the first adhesive coated copper and the second adhesive coated copper are pressed on opposite surfaces of the semi-cured film, thereby embedding the first electronic elements in the semi-cured film; the first adhesive layer is partially removed to define first holes for exposing electrodes of the first electronic element; the electrodes are electrically connected with the first copper layer. A circuit board made by the method is also provided.