Low-Profile Electronic Module With Embedded Power Substrate
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Solution Overview
Problem
The demand for miniaturized and lightweight electronic components in portable devices necessitates a package technology that reduces the mounting height of components while effectively shielding electromagnetic waves and protecting semiconductor chips from external environments.
Innovation Solution
An electronic device module is designed with a first substrate, a second substrate for power connection, a connecting conductor, and a sealing portion that exposes the conductor and device externally, featuring a shielding layer and protective layer to reduce overall thickness and shield electromagnetic waves, with the second substrate's mounting height being lower than the device's, using materials like solder and conductive resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods are used to protect electronic devices and shield electromagnetic waves, then reliability and electromagnetic shielding are improved, but the mounting height and overall thickness increase
Solution Approach 1:
The electronic device is embedded within a cavity formed in the sealing portion, creating a nested structure where the device is housed inside the sealed enclosure. This nesting approach protects the device while maintaining a compact overall height, as the sealing portion integrates the protective function without adding excessive external dimensions
Solution Approach 2:
The patent transitions from traditional vertical stacking to a configuration where the electronic device is positioned within a cavity of the sealing portion. By utilizing the internal space of the sealing structure rather than adding height externally, the design achieves protection and shielding while reducing mounting height
2Object-affected harmful factors
If shielding layers and protective structures are added to shield electromagnetic waves and protect components, then electromagnetic shielding and reliability are improved, but device complexity and thickness increase
Solution Approach 1:
The sealing portion serves multiple functions simultaneously: it provides mechanical protection for the electronic device, acts as an electromagnetic shielding barrier, and maintains structural integrity. By integrating these multiple functions into a single component rather than adding separate layers for each function, the design achieves comprehensive protection without proportionally increasing complexity
Solution Approach 2:
The patent combines the protective enclosure and electromagnetic shielding functions into the sealing portion itself. Rather than adding separate shielding layers outside the protective housing, the shielding capability is integrated into the sealing structure, merging multiple protective functions into one unified component that reduces overall complexity
3Length of stationary object
If the second substrate is positioned at a lower mounting height than the electronic device, then overall thickness is reduced, but electrical connection complexity increases
Solution Approach 1:
Instead of positioning the second substrate at the same level or above the electronic device as in traditional designs, the patent inverts the conventional arrangement by placing the second substrate lower, within the cavity of the sealing portion. This inverted positioning reduces overall thickness while the connecting conductor bridges the height difference to maintain electrical connectivity
4Ease of operation
If connecting conductors are exposed externally for electrical connection, then ease of connection is improved, but protection from external environment is worsened
Solution Approach 1:
The connecting conductor is extracted from the sealed enclosure through an opening in the sealing portion, allowing external electrical connection while minimizing the breach in the protective barrier. The conductor passes through the sealing structure rather than being completely exposed, maintaining protection for the majority of the connection path
Solution Approach 2:
The sealing portion acts as a flexible yet protective barrier that accommodates the passing of the connecting conductor through it. The sealing structure maintains its protective integrity while allowing the necessary electrical connection to pass through, balancing protection with accessibility
Data Source
AI summary
An electronic device module includes a first substrate, at least one electronic device mounted on a lower surface of the first substrate, a second substrate mounted on a lower surface of the first substrate to electrically connect the first substrate to an external source of power, a connecting conductor bonded to a lower surface of the second substrate, and a sealing portion sealing the electronic device, the second substrate, and the connecting conductor, wherein a mounting height of the second substrate is configured to be lower than a mounting height of the electronic device.