IC Load Frame Alignment and Biasing Mechanism

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Solution Overview

Problem

Integrated circuit packages face challenges in proper alignment and damage prevention due to the fragility and close arrangement of electrical contacts during installation into sockets, which complicates the handling and latching process.

Innovation Solution

A load frame and base frame system with alignment posts and biasing devices ensures precise alignment and secure latching of the integrated circuit package to the socket, reducing contact damage and eliminating the need for separate handling tools, while finger grip handles facilitate safe handling and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the electrical contacts are arranged in large arrays with relatively little space between individual contacts to accommodate the large number of contacts, then the quantity of electrical contacts is improved, but the fragility and susceptibility to damage of the contacts worsens

Engineering Contradiction:

Improvequantity of electrical contactsVSAvoidfragility and susceptibility to damage of contacts

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

A socket is introduced as an intermediary component between the integrated circuit package and the printed circuit board. The socket contains recesses that receive and protect the electrical contacts, providing a protective environment that reduces fragility and susceptibility to damage while still accommodating the large quantity of contacts in array format

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The socket structure provides beforehand protection for the electrical contacts by enclosing them in recesses before installation. This pre-protective structure cushions the contacts against mechanical damage during handling and installation, addressing the fragility issue before it can manifest

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Quantity of substance

If the electrical contacts are arranged in large arrays with relatively little space between individual contacts, then the quantity of electrical contacts is improved, but the difficulty of proper alignment between contacts of the integrated circuit package and socket worsens

Engineering Contradiction:

Improvequantity of electrical contactsVSAvoidalignment precision between contacts

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The socket serves as a mediating structure that contains precisely positioned recesses for each electrical contact. This intermediary component provides the necessary alignment references and tolerance compensation, enabling proper alignment between the integrated circuit package contacts and the printed circuit board connections despite the high density of contacts

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The socket is segmented into multiple individual recesses, each designed to receive and align a specific electrical contact. This segmentation allows each contact to be independently positioned and aligned, facilitating proper alignment across the entire large array of contacts

Inventive Principle:

Principle #1Segmentation

3Ease of operation

If manual handling of the integrated circuit package is used, then the ease of operation is improved, but the susceptibility to contact damage worsens

Engineering Contradiction:

Improveease of manual handlingVSAvoidsusceptibility to contact damage

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The socket acts as a protective intermediary that receives the electrical contacts during manual handling and installation. By providing this protective structure, operators can handle the integrated circuit package with greater ease while the socket continuously protects the contacts from damage throughout the installation process

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves precise alignment and secure latching of the integrated circuit package, reducing contact damage and simplifying the installation process, thereby enhancing the reliability and efficiency of the integration with printed circuit boards.

Implementation Method 1

a biasing device, such as a spring, that is resilient between the load frame and the base frame

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9681556B2Contact protection for integrated circuit device loading

Publication Date: 2017.06.13 INTEL CORP

AI summary

In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.