Reconfigurable Modular Computing Device Signal Routing
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Solution Overview
Problem
Conventional computing devices are limited in their ability to accommodate a broad range of applications with a single device, as they are typically preconfigured for specific functions and environments, lacking the flexibility to adapt to different applications and conditions.
Innovation Solution
A reconfigurable modular computing device (RMCD) comprising a printed circuit board with first and second microcontrollers, a computer-on-module, and peripheral modules, allowing for electrical signal communication and reconfiguration to support various applications by determining and configuring signal flow paths based on device profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional computing device is preconfigured for a specific function, then it achieves reliable performance for that function, but it cannot accommodate a broad range of applications
Solution Approach 1:
The computing device is divided into separate functional modules including a base unit with processor and memory, and detachable peripheral modules containing display screens, keyboards, and other interfaces. This segmentation allows the core computing unit to remain simple while enabling versatility through module combination and reconfiguration.
Solution Approach 2:
The base computing unit is designed as a universal platform that can interface with multiple types of peripheral modules through standardized connections. The system can configure different operational modes by connecting the base unit to various combinations of display screens, keyboards, touchpads, and other peripherals, making a single device serve multiple application purposes.
2Adaptability or versatility
If a computing device is designed with multiple preconfigured functions, then it can support various applications, but it increases manufacturing cost and device complexity
Solution Approach 1:
By segmenting the device into a standardized base unit and separate peripheral modules, manufacturing can be optimized through mass production of common components. The base unit with processor and memory is manufactured once and reused across multiple configurations, while peripheral modules are produced separately and assembled through standardized interfaces, reducing overall manufacturing cost compared to producing multiple complete preconfigured devices.
Solution Approach 2:
The device employs dynamic reconfiguration capabilities where the computing unit can adapt its configuration at runtime by connecting to different peripheral modules. This dynamic adaptability eliminates the need to manufacture multiple static device variants, as a single base unit can be dynamically configured for different applications through module attachment and detachment.
3Ease of manufacture
If a computing device uses standardized components, then it reduces manufacturing cost, but it may compromise performance optimization for specific applications
Solution Approach 1:
The standardized base unit incorporates a universal processor and memory system that maintains high performance across different applications. Through standardized interfaces and configuration protocols, the same base unit can be optimized for different application types by connecting to appropriate peripheral modules, ensuring both manufacturing efficiency and application-specific performance reliability.
Data Source
AI summary
A configurable computing device comprising a housing, a printed circuit board disposed within the housing, a first microcontroller and a second microcontroller each coupled to the PCB, wherein the first microcontroller and the second microcontroller are in electrical signal communication with each other, a computer-on-module (COM) coupled to the PCB, wherein the COM is in electrical signal communication with the first microcontroller and the second microcontroller, and one or more peripheral modules coupled to the PCB, wherein, the peripheral modules are each in electrical signal communication with the first microcontroller and wherein, the peripheral modules are each in electrical signal communication with the COM via the second microcontroller.