PCB Heat Distributor for LED Thermal Management
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Solution Overview
Problem
Conventional electronic assemblies for high-power LEDs suffer from inefficient heat dissipation due to the concentration of heat losses in a small area, leading to premature aging and reduced lifespan, as the existing designs rely on limited thermal conductivity of FR4 printed circuit boards and conventional copper layers.
Innovation Solution
A printed circuit board with a continuous cutout and a segmented heat distributor, where the heat distributor is material-bonded to the PCB and allows for direct lateral heat dissipation, enabling improved thermal management by using a thicker, thermally conductive material like silver, copper, or aluminum, and reducing the reliance on plated-through holes for heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional FR4 printed circuit board with copper layers is used for heat dissipation, then the structure is simple and manufacturing is easy, but the thermal conductivity is insufficient leading to concentrated heat losses and reduced LED lifespan
Solution Approach 1:
The patent applies composite materials by integrating a heat distributor made of thermally conductive material (such as metal) with the FR4 printed circuit board. This creates a hybrid structure that combines the electrical insulation and structural properties of FR4 with the high thermal conductivity of metal, enabling effective heat dissipation while maintaining electrical functionality. The heat distributor is coupled to the PCB via plated-through holes, forming a composite thermal management system that resolves the contradiction between simple structure and adequate thermal performance.
2Loss of energy
If heat is dissipated vertically through plated-through holes only, then the PCB structure remains intact, but lateral heat transport is insufficient causing heat concentration in small areas
Solution Approach 1:
The heat distributor is designed with a segmented structure featuring multiple cutouts that correspond to LED mounting positions. This segmentation allows the heat distributor to be integrated with the PCB while providing dedicated heat dissipation zones. The cutouts enable direct thermal coupling between LEDs and the heat distributor through plated-through holes, while the remaining solid portions of the heat distributor provide lateral heat transport pathways, effectively dividing the heat management function into discrete zones.
Solution Approach 2:
The invention transitions from purely vertical heat dissipation through plated-through holes to include lateral heat transport within the plane of the heat distributor. By adding this horizontal dimension to heat flow, the system can spread heat over a larger area before vertical dissipation, reducing heat concentration at LED locations while maintaining structural integrity through the PCB coupling.
3Volume of moving object
If high-power LEDs are mounted on conventional PCB without dedicated heat distribution, then the assembly is compact, but heat losses are concentrated leading to premature aging
Solution Approach 1:
The heat distributor serves as an intermediary component between the high-power LEDs and the PCB. It is coupled to the PCB via plated-through holes and provides a dedicated thermal pathway that intercepts heat from LEDs and redistributes it laterally before vertical dissipation. This intermediary structure enables compact LED mounting while preventing heat concentration, as the heat distributor mediates the thermal interaction between LEDs and the surrounding environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances lateral heat transport and dissipation, reducing the temperature of high-power LEDs by up to 8.4 Kelvin, thereby extending their lifespan and improving thermal performance in compact lighting applications.
Implementation Method 1
The heat distributor (22) has at least one first contact surface (221a, 222a, 223a) and at least one second contact surface (221b, 222b, 223b) opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB... significantly enhances lateral heat transport and dissipation
Data Source
AI summary
An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.