Component Holding Structure for Vertical PCB Stacking

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Solution Overview

Problem

The existing methods for mounting multiple electronic components on printed circuit boards (PCBs) often result in wasted space and compromised mechanical integrity due to the need for hand-stacking and soldering, which increases assembly costs and requires secondary mechanical support.

Innovation Solution

A component holding structure with opposing end walls and lead guides is used to securely stack axial through-hole components vertically, allowing for efficient use of PCB space and eliminating the need for hand soldering and secondary support by facilitating a wave solder process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple components are hand stacked and soldered, then the components can be vertically arranged to reduce X-Y space usage, but the mechanical integrity of the assembly is compromised and secondary mechanical support is required

Engineering Contradiction:
ImprovePCB space usageVSAvoidmechanical integrity
Core Design Contradiction:
Area of stationary objectVSStrength

Solution Approach 1:

The holding structure is divided into multiple cavities, each capable of independently receiving and securing a through-hole component. Each cavity acts as a separate segmentation that provides individual mechanical support while contributing to the overall vertical stacking arrangement, thereby maintaining both space efficiency and mechanical integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The holding structure serves as an intermediary component between the PCB and the stacked through-hole components. It provides the necessary mechanical support and positioning, eliminating the need for secondary mechanical support while enabling vertical arrangement to reduce PCB footprint.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If multiple components are hand stacked and soldered, then vertical stacking is achieved, but assembly complexity and cost increase due to manual operations

Engineering Contradiction:
ImprovePCB space usageVSAvoidassembly process complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The holding structure is pre-formed with multiple cavities and integrated support features before assembly. This preliminary preparation enables automated placement of multiple components in vertical stacks without requiring manual stacking and soldering operations, thereby reducing assembly complexity while maintaining space efficiency.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If traditional placement methods are used, then assembly process is simple, but significant planar PCB space is occupied

Engineering Contradiction:
Improveassembly simplicityVSAvoidPCB space usage
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The holding structure enables transition from traditional planar (2D) component placement to vertical (3D) stacking arrangement. Multiple through-hole components are arranged vertically within cavities of the holding structure, significantly reducing the planar PCB footprint while maintaining ease of manufacture through automated assembly processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9398701B2Component holding structures, system, and method
Publication Date: 2016.07.19 ACLEAP POWER INC
  • US9398701B2 patent drawing
  • US9398701B2 patent drawing
  • US9398701B2 patent drawing

AI summary

A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.