Solder Supply Control for Printed Circuit Board Mask Sheets
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Solution Overview
Problem
Existing solder supply systems fail to accurately adjust solder amounts across different points in the X direction of a mask sheet, leading to inefficiencies and increased rolling operations due to variations in opening areas and solder distribution.
Innovation Solution
A method and apparatus that calculate and adjust solder amounts at multiple points in the X direction using detection sensors and servo motors to ensure precise solder distribution, incorporating a calculation unit to determine necessary adjustments based on measured solder width or cross-sectional area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If solder amount is adjusted using measurement result from only one measurement position, then the adjustment process is simple, but the solder amount cannot be sufficiently adjusted at other positions where measurement is not carried out
Solution Approach 1:
The mask sheet surface is divided into multiple measurement positions in the X direction, with detection sensors positioned at each segment to independently measure solder width. This segmentation allows the system to capture spatial variations in solder distribution across the entire surface, enabling precise adjustment at each position rather than relying on a single measurement point.
Solution Approach 2:
The system implements position-specific solder amount adjustment by calculating the required solder amount for each measurement position based on its measured solder width. The solder supply mechanism then delivers customized solder amounts to each position, ensuring that areas with insufficient solder receive more while areas with excess solder receive less, achieving uniform solder distribution tailored to local conditions.
2Device complexity
If the moving range of a head is short compared to the length of the squeegee, then the system structure is compact, but making the amount of solder supplied uniform at each point in the X direction disadvantageously increases the number of solder rolling operations
Solution Approach 1:
The system performs preliminary measurement of solder width at multiple positions before the soldering process. Based on these pre-measured values, it calculates and prepares the required solder amount for each position in advance. This preliminary action enables the solder supply mechanism to deliver the correct amount of solder to each position during a single pass, eliminating the need for multiple rolling operations to achieve uniformity.
Solution Approach 2:
The system implements a feedback loop where detection sensors continuously measure solder width at each position, the control unit calculates the required solder amount based on these measurements, and the solder supply mechanism adjusts delivery accordingly. This real-time feedback ensures uniform solder distribution is achieved in one operation rather than requiring multiple corrective rolling passes.
Data Source
AI summary
Provided is a solder supply method of supplying, onto a mask sheet, solder to be printed on a printed circuit board. The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee, and changing the amount of solder supplied at each point in the X direction based on a result of the calculation.