Circuit Layout Design Rule Customization for Fabrication

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor circuit fabrication across different facilities results in unintended differences due to varying manufacturing processes, leading to mismatches in circuit element values and wide tolerance ranges, which are not effectively addressed by existing methods.

Innovation Solution

A computer system selects and customizes circuit layouts for each fabrication facility based on historical data, adjusting geometric characteristics of circuit elements to align with target values, thereby generating unique layouts that minimize inter-fabrication facility mismatches and narrow tolerance ranges.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a common circuit layout is used across multiple fabrication facilities, then manufacturing cost is reduced, but manufacturing precision deteriorates due to process variations between facilities

Engineering Contradiction:
Improvemanufacturing costVSAvoidcircuit element value consistency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies local quality by customizing circuit layout design rules specifically for each fabrication facility based on their unique process characteristics. Instead of using a uniform layout across all facilities, the system adjusts geometric characteristics of circuit elements (such as capacitor plate area, resistor dimensions, transistor gate length) to match the specific manufacturing capabilities and variations of each facility, thereby maintaining precision while enabling multi-facility production

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements parameter changes by modifying geometric parameters of circuit elements in the layout design rules for each fabrication facility. The system adjusts parameters such as capacitor plate area, resistor track width, and transistor dimensions based on empirical data from each facility's historical fabrication results, allowing the same circuit functionality to be achieved with different geometric parameters that compensate for facility-specific process variations

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If fabrication process variations between facilities are accommodated, then adaptability is improved, but manufacturing precision deteriorates due to wide tolerance ranges

Engineering Contradiction:
Improvefacility compatibilityVSAvoidcircuit element value tolerance
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-characterizing each fabrication facility's process variations and incorporating this knowledge into the layout design rules before fabrication begins. The system collects empirical data from each facility's historical production, analyzes their specific variations, and pre-adjusts the geometric characteristics of circuit elements to compensate for expected deviations, thereby maintaining precision while accommodating facility-specific characteristics

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback by using empirical data from each fabrication facility's historical fabrication results to continuously refine and update the facility-specific design rules. The system monitors actual circuit element values produced at each facility and uses this feedback to adjust geometric parameters in subsequent layout generations, progressively narrowing tolerance ranges while maintaining adaptability to each facility's process characteristics

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS10956646B2Customizing circuit layout design rules for fabrication facilities
Publication Date: 2021.03.23 TEXAS INSTRUMENTS INC
  • US10956646B2 patent drawing
  • US10956646B2 patent drawing

AI summary

In some embodiments, a method includes selecting, a first circuit layout, where the first circuit layout includes a circuit element representation, a design rule, and a target circuit element value. The method further includes receiving a plurality of circuit element values of circuit elements fabricated in each of multiple fabrication facilities using the design rule. The method also includes selecting a fabrication facility and a circuit element value of circuit elements fabricated in the selected fabrication facility using the design rule. Further the method includes determining a circuit element value calculation based on the selected circuit element values, and determining an adjustment value. This adjustment value is further used to customize the design rule. The method then includes generating a second circuit layout comprising the customized design rule, causing the fabrication facility to fabricate a circuit using the second circuit layout.