Solid-State Devices TRIZ Cases

A high reflective coating on an LED submount redirects scattered light, reducing absorption losses and preventing yellowing.

Reflection interfaces adjust optical distances to maintain uniform intensity and chromaticity across viewing angles.

Three-dimensional AND flash memory pillars use sacrificial layer replacement to form independent conductor layers for high-speed operation.

A light-shielding body with particles controls luminous intensity, resolving uniform chromaticity issues from black pigment mixing.

An electron withdrawing layer composed of a Lewis acid compound reduces contact resistance and increases charge mobility in organic electroluminescent displays.

A photosensor uses a segmented opaque mask and deep central photodiode to admit light through openings while blocking stray signals from adjacent units.

A thin film transistor array panel uses polycrystalline semiconductors to boost field effect mobility and optical stability.

Variable thickness planarization reduces gas displacement in micro LED displays by applying local quality changes to the structural support layer.

Conformal deposition and planarization create self-aligned islanding gates, resolving misalignment issues in NAND memory manufacturing.

Adjusting threshold voltage via back gate doping simplifies gate stack structure, resolving complexity in bulk-SOI hybrid CMOS manufacturing.

An air gap isolation structure reduces parasitic capacitance in non-volatile memory devices, suppressing cell-to-cell interference and improving reliability.

Phenyl silicone encapsulants resist sulfur vapors to prevent brightness loss in LED packages.

Stacked interconnect lines with dummy segments reduce voltage drop in the peripheral circuit region, resolving miniaturization reliability trade-offs.

Segmenting the channel layer into regions with varying impurity concentrations reduces leakage current and enhances operational reliability.

A display panel incorporates a main light-transmitting region surrounded by pixel units to route external light to an image acquisition device.

Segmented mask plates form continuous curved encapsulation layers that extend diffusion paths, reducing edge width while preventing water and oxygen intrusion.

Epitaxially grown extension portions increase the contact area between active regions and conductive contacts in semiconductor devices.

Dummy gate patterns balance light absorption rates to reduce temperature irregularities caused by heat transfer from the logic circuit region.

A dual-pixel full color CMOS imager uses a two-photodiode stack structure to increase capacitance and well capacity.

Gold or copper electrodes on perovskite insulators reduce series resistance by avoiding platinum layers.

Magnetic electrodes enable simultaneous electrical connection and mechanical mounting, preserving the light emission area while maintaining hermetic sealing.

High resistance transparent conductive material prevents short-circuits from pinholes while scattering particles improve light extraction.

Cassette display units select uncovered surfaces using photosensors and pressure sensors to show patient information.

A buffer layer enhances adhesion between substrate and gate while blocking copper diffusion into the insulating film.

Concave microstructures on an oxidized metal foil substrate disperse light to reduce modal loss at the interface.

A functional panel uses reduced-pressure bonding to transfer thin film elements onto flexible substrates without adhesive layers.

Next-generation lithography forms compacted functional cell arrays with sub-100 nm precision.

Matrix spacer plates block blue light interference between color conversion units, increasing contrast ratio.

A stacked infrared filter uses overlapping spectral layers to transmit narrow-band light.

A ferroelectric memory device incorporates a two-dimensional electron gas channel to maintain high reading currents.

A sealing film structure uses a hollow recess to position an organic layer beneath an inorganic barrier.

Laser ablation patterns OLED electrodes and passivation layers, eliminating open mask alignment defects and reducing equipment complexity.

Pre-formed cavities shield image sensing areas from pollution and damage during packaging while exposing pads via cutting processes.

A stacked light-emitting element uses exciplexes to transfer triplet energy, overcoming limited external quantum efficiency in phosphorescent devices.

Shared light sensing metal layers integrate photosensors and switch elements, reducing mask steps and production costs.

Segmenting polyimide into thin layers separated by metal films eliminates internal mechanical stresses and curl, enabling easier handling of thick substrates.

Patterned solder mask layers define pixel separation regions on CZT semiconductor substrates to isolate anode electrodes.

Integrating a waveguide along the mount substrate surface reduces device height by eliminating perpendicular light paths.

A dual-layer pixel define layer structure with hydrophobic and hydrophilic films prevents organic material splashing during inkjet printing.

A pixel structure integrates a molybdenum oxide barrier layer between copper electrodes and semiconductor layers to secure stable adhesion.

Alternating bit line patterns define a double-patterned memory cell array layout, restoring electrical symmetry across the structure.

Multi-dimensional stacked gate structures deflect concentrated electric fields, reducing leakage current while maintaining device performance.

Graded Al composition in stacked layers manages carriers to reduce power output decrease at high current densities.

MIT material enhances non-linearity, reducing unwanted current from half-selected elements and increasing memory density.

A display panel light processing layer mixes diffusion and conversion materials to improve light emission uniformity.

A computer system customizes circuit layout design rules using historical fabrication data to align element values with targets.

A perovskite-silicon tandem solar cell incorporates a doped metal oxide layer to convert low-energy photons into usable light.

Ozone adsorbents lower ozone levels in organic EL ink solvents, preventing oxidative deterioration and extending device lifespan.

Lyophobic barrier structures on pixel defining layer sidewalls reduce ink climbing height, preventing uneven film formation and improving display uniformity.

Pulverizing thermosetting resin composition to reduce cured product particle size below chip thickness.