Polycrystalline Thin Film Transistor Array Panel Crystallization

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Solution Overview

Problem

Current thin film transistor array panels face challenges in achieving high field effect mobility and optical stability while maintaining simple manufacturing processes, with amorphous semiconductor thin films having low mobility and high photo leakage, and polycrystalline semiconductor films requiring complex processes and high costs.

Innovation Solution

A thin film transistor array panel is designed with a substrate, gate lines, polycrystalline semiconductors, data lines, and pixel electrodes, incorporating ohmic contacts and an assistant layer, where the semiconductors have different impurity concentrations and thicknesses to enhance mobility and stability, and a method involving crystallization of amorphous semiconductors to form polycrystalline semiconductors without additional masks or ion doping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If amorphous semiconductor thin film is used, then low temperature processing is enabled, but field effect mobility is low and photo leakage is high

Engineering Contradiction:
Improveprocessing temperatureVSAvoidfield effect mobility
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent changes the physical state of the semiconductor material from amorphous to polycrystalline through controlled crystallization processes, thereby improving field effect mobility while maintaining compatibility with low-temperature substrate materials. The crystallization is achieved through specific thermal treatment regimes that transform the semiconductor structure without requiring high-temperature processing.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If polycrystalline semiconductor thin film is used, then field effect mobility and optical stability are improved, but manufacturing process becomes complex and cost increases

Engineering Contradiction:
Improvefield effect mobilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the crystallization process with existing manufacturing steps by integrating it into the semiconductor formation sequence. The crystallization is performed in-situ during the fabrication process, eliminating the need for separate complex processing stages and reducing overall manufacturing complexity while achieving polycrystalline structure benefits.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs self-organized crystallization mechanisms where the semiconductor material automatically forms polycrystalline structures through controlled thermal treatment without requiring additional masking or ion doping steps. This self-service approach simplifies the manufacturing process by eliminating complex external interventions.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves field effect mobility and optical stability while simplifying the manufacturing process, reducing costs by using a bottom gate structure and eliminating the need for additional masks or ion doping, resulting in a more efficient and cost-effective thin film transistor array panel.

Implementation Method 1

forming the polycrystalline semiconductor thin film requires a process of crystallizing a semiconductor on a substrate

Methodology Applied
Scientific EffectCrystallization: Crystallisation

Data Source

PatentUS8202758B2Thin film transistor array panel and method of manufacturing the same
Publication Date: 2012.06.19 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US8202758B2 patent drawing
  • US8202758B2 patent drawing
  • US8202758B2 patent drawing

AI summary

The present invention provides a thin film transistor array panel which includes a substrate, gate lines formed on the substrate, polycrystalline semiconductors formed on the gate lines, data lines formed on the polycrystalline semiconductors and including first electrodes, second electrodes formed on the polycrystalline semiconductors and facing the first electrodes, and pixel electrodes connected to the second electrodes.