Functional Panel Peeling Process for Flexible Device Manufacturing
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Solution Overview
Problem
The existing methods for manufacturing flexible devices with functional elements, such as semiconductor or light-emitting devices, require complex peeling processes and adhesive layers, which increase material costs and manufacturing steps, and do not efficiently transfer thin film elements from high-heat substrates to flexible substrates.
Innovation Solution
A method involving a reduced-pressure atmosphere bonding of layers with a sealing portion and subsequent peeling in a higher-pressure atmosphere, allowing for the transfer of functional elements from a high-heat substrate to a flexible substrate without an adhesive layer, reducing material costs and manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are used to bond layers during peeling process, then bonding strength is improved, but material cost and device complexity increase
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the device structure. By using a peeling layer with controlled adhesion to the formation substrate, the functional element can be transferred without requiring adhesive layers between the functional element and flexible substrate, thereby reducing material cost and device complexity while maintaining bonding strength through the peeling process itself
Solution Approach 2:
The peeling layer serves as an intermediary between the formation substrate and the flexible substrate. This intermediate layer enables controlled peeling and transfer of the functional element without requiring adhesive layers, as the peeling layer's adhesion properties facilitate the transfer process while being removable afterward
2Reliability
If multiple adhesive layers are used for layer bonding, then bonding reliability is improved, but manufacturing steps and material cost increase
Solution Approach 1:
The invention removes adhesive layers from the manufacturing process by using the peeling layer's inherent adhesion to the formation substrate. The functional element is transferred to the flexible substrate through the peeling process itself, eliminating the need for separate adhesive layer application steps and reducing material cost while maintaining bonding reliability
Solution Approach 2:
The peeling layer performs multiple functions: it provides bonding to the formation substrate during fabrication, enables controlled peeling during transfer, and facilitates self-bonding of the functional element to the flexible substrate through the peeling process, eliminating the need for separate adhesive materials and simplifying manufacturing
3Ease of manufacture
If peeling process is performed without adhesive layer, then material cost and manufacturing steps are reduced, but transfer precision may be affected
Solution Approach 1:
The invention applies local quality by creating a peeling layer with spatially varying adhesion properties. The peeling layer has controlled adhesion to the formation substrate in specific regions, enabling precise control over where peeling occurs and ensuring accurate transfer of the functional element to the flexible substrate without requiring adhesive layers
Solution Approach 2:
The peeling layer is pre-formed on the formation substrate during the fabrication process, establishing controlled adhesion properties before the transfer operation. This preliminary action ensures that when peeling is performed, the functional element transfers with high precision to the flexible substrate without requiring adhesive layers or complex alignment procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of lightweight, flexible, and reliable devices by eliminating the need for adhesive layers and simplifying the manufacturing process, while maintaining the integrity of the functional elements.
Implementation Method 1
bonding of layers with a sealing portion in a reduced-pressure atmosphere
Implementation Method 2
The first adhesive layer is between the first layer and the first substrate
Data Source
AI summary
A novel functional panel is provided. The functional panel includes a first substrate, a second substrate, a first layer, a second layer, a sealing portion, and a first adhesive layer. The sealing portion is between the first layer and the second layer. The first adhesive layer is between the first layer and the first substrate. The second substrate is in contact with the second layer. When a surface of the first layer which faces the first substrate is referred to as a first surface and a surface of the second layer which is in contact with the second substrate is referred to as a second surface, the functional panel has a plurality of regions having different distances between the first surface and the second surface.