Micro LED Drive Backplane with Variable Thickness Planarization
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Solution Overview
Problem
Micro LED display panels face challenges in installing LEDs on driving substrates due to high gas storage capacity in planarization layers, leading to reduced reliability and increased gas displacement.
Innovation Solution
A drive backplane design featuring a base substrate with a driving device layer, a planarization layer with projection and base portions, a conductive layer, a spacer layer, and a binding layer, which reduces gas displacement by increasing the height of the binding layer and local thickness of the planarization layer, facilitating better installation of light-emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planarization layer with uniform thickness is used in the driving substrate, then the manufacturing process is simple, but the gas storage capacity is large leading to high gas displacement and reduced product reliability
Solution Approach 1:
The planarization layer is designed with different thicknesses in different regions: a first thickness in the first region and a second thickness in the second region, where the thickness ratio is controllable. This local quality variation reduces the overall gas storage capacity while maintaining structural integrity and manufacturing feasibility.
2Loss of substance
If the planarization layer thickness is reduced uniformly, then gas storage capacity decreases, but the structural support and manufacturing precision are compromised
Solution Approach 1:
Different regions of the planarization layer have different thicknesses optimized for their specific functions. The first region maintains sufficient thickness for structural support, while the second region has reduced thickness to minimize gas storage, achieving both precision and gas reduction goals.
Solution Approach 2:
The solution moves from a uniform 2D planarization layer to a 3D variable thickness structure, allowing thickness to vary across different spatial regions. This dimensional approach enables simultaneous optimization of gas storage reduction and structural precision maintenance.
3Loss of substance
If the planarization layer thickness is reduced, then gas displacement decreases, but the ease of manufacture and structural stability are affected
Solution Approach 1:
The variable thickness design allows critical manufacturing areas to maintain sufficient thickness for ease of fabrication, while non-critical areas have reduced thickness to minimize gas storage. This localized approach preserves manufacturing ease overall while achieving gas reduction.
Data Source
AI summary
A drive backplane, a display panel, an electronic apparatus, and a method for preparing a drive backplane are provided in embodiments of the disclosure, all relating to the technical field of display technology, the drive backplane including: a base substrate; a driving device layer on the base substrate, comprising an electrode layer; a planarization layer, on a surface of the driving device layer facing away from the base substrate, and the planarization layer being provided with at least one projection portion and at least one base portion adjacent to the at least one projection portion both on a surface of the planarization layer facing away from the driving device layer, each projection portion having a greater thickness than that of each base portion; a conductive layer, on respective surface of each projection portion facing away from the driving device layer, the conductive layer being connected with the electrode layer of the driving device layer; a spacer layer, on a surface of the conductive layer facing away from the planarization layer; and a binding layer, covering both a surface of the spacer layer facing away from the conductive layer and the surface of the conductive layer facing away from the planarization layer, the binding layer being where a light-emitting device is to be provided.