Phenyl Silicone Encapsulant for LED Chemical Resistance
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Solution Overview
Problem
Conventional LED packages suffer from chemical degradation due to gas permeable encapsulants, leading to reduced brightness and reliability, especially when exposed to sulfur, chlorine, and other chemical vapors, which affects the longevity and performance of silver and copper components.
Innovation Solution
The use of a phenyl silicone encapsulant with improved chemical resistance properties, such as KER-6000 or ASP-1110, is introduced to replace conventional methyl silicone encapsulants, providing a protective barrier against chemical vapors and maintaining the brightness and reliability of LED packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional gas permeable encapsulants are used, then ease of manufacture is maintained, but chemical resistance deteriorates allowing sulfur and chlorine vapors to degrade LED components
Solution Approach 1:
The patent changes the chemical composition parameters of the encapsulant from conventional methyl silicone to phenyl silicone with specific chemical resistance properties. This parameter change enables the encapsulant to resist sulfur and chlorine vapors while maintaining manufacturability through established molding processes.
Solution Approach 2:
The patent employs composite material strategies by combining phenyl silicone encapsulant with phosphor particles to create a chemically resistant filling material. This composite approach maintains the ease of manufacture of conventional encapsulants while dramatically improving chemical resistance against degradation vapors.
2Reliability
If conventional methyl silicone encapsulants are used, then ease of manufacture is maintained, but brightness retention deteriorates due to chemical degradation
Solution Approach 1:
The patent modifies the encapsulant material parameters from methyl silicone to phenyl silicone, which has superior chemical stability. This change enables the encapsulant to protect LED components from chemical degradation that causes brightness loss, while the processing parameters remain compatible with existing manufacturing equipment and procedures.
3Reliability
If phenyl silicone encapsulant is used, then chemical resistance is improved, but device complexity increases
Solution Approach 1:
The patent implements a parameter change in the encapsulant material composition from methyl silicone to phenyl silicone. This single material substitution provides improved chemical resistance without requiring additional package structures, layers, or components, thereby avoiding increased device complexity.
4Illumination intensity
If conventional encapsulants are used, then ease of operation is maintained, but brightness loss increases due to vapor permeation
Solution Approach 1:
The patent changes the encapsulant material parameters to phenyl silicone, which has lower permeability to sulfur and chlorine vapors. This parameter change reduces brightness loss by preventing chemical degradation of LED components, while the material can be selected and processed using conventional manufacturing approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phenyl silicone encapsulant significantly reduces brightness loss and maintains the integrity of silver and copper components, offering improved chemical resistance and reliability in high-power and high-brightness applications, with optimized packages showing minimal degradation even under extended sulfur exposure.
Implementation Method 1
Conventional encapsulants may be gas permeable which can allow undesirable chemicals and/or chemical vapors to enter the LED package and degrade various components within the package. Phenyl silicone encapsulants can be used to reduce the permeability of chemical vapors... significantly reduce the permeation of sulfur and other chemical vapors
Data Source
AI summary
Light emitter packages, components, and related methods for providing improved chemical resistance are provided herein. In one aspect, a component of a light emitter package is provided. The component can include a base material, a silver (Ag) containing material at least partially disposed over the base material, and a portion of phenyl containing silicone encapsulant at least partially disposed over the Ag portion. The component can be incorporated within a surface mount device (SMD) type light emitter package.