3D Circuit Formation via Chemical Plating Blocker
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Solution Overview
Problem
Existing methods for separating conductive layers on a substrate, such as mechanical trenches and photoresist materials, can cause damage and are not chemically precise, leading to a need for improved chemical separation techniques.
Innovation Solution
The method involves embedding a conductor layer in a substrate, forming a cavity, coating it with a plating blocker material, ablating the blocker to expose the conductor, and using electroless metal plating to deposit a second conductor layer while inhibiting plating on the blocker material, thereby chemically separating the conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical trench is used to separate electrical conductors, then separation is achieved easily, but damage occurs to metal deposited close to the trench
Solution Approach 1:
A plating blocker material is introduced as an intermediary substance between conductors to prevent metal deposition in unwanted areas. This mediator selectively blocks plating chemistry without requiring mechanical damage to surrounding metal, resolving the contradiction between easy separation and avoidance of metal damage.
Solution Approach 2:
The patent replaces the mechanical trenching system with a chemical plating blocking system. Instead of using physical mechanical forces to create separation trenches, the invention uses chemical substances (plating blockers) to prevent metal deposition, thereby achieving separation without mechanical damage to adjacent metal structures.
2Manufacturing precision
If photoresist material is used to separate metal deposition, then separation precision is improved, but physical application and removal processes are required
Solution Approach 1:
The patent replaces physical photoresist application and removal processes with a chemical plating blocking approach. The plating blocker material is applied through standard plating processes and removed chemically, eliminating the need for separate physical application and removal steps while maintaining separation precision.
Solution Approach 2:
The invention changes the fundamental parameter of separation from physical barrier (photoresist) to chemical barrier (plating blocker). This parameter change allows the separation material to be integrated into the plating process itself, reducing overall process complexity while maintaining precision.
3Reliability
If plating blocker material is used to prevent metal plating, then unwanted plating is prevented, but the blocker material must be removed after use
Solution Approach 1:
The plating blocker material is designed to be temporarily discarded after serving its separation function. The blocker is removed after the plating process completes, allowing the underlying conductor to be accessed. This temporary use and disposal approach maintains plating control while minimizing impact on overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and damage-free separation of conductive layers, enabling even metal deposition on complex substrates and preventing unwanted plating, thus enhancing the reliability of electrical circuits.
Implementation Method 1
Electroless metal deposition uses a redox reaction to deposit a layer of metals on a substrate without passage of an electric current
Implementation Method 2
Electroless metal deposition uses a redox reaction to deposit a layer of metals on a substrate without passage of an electric current
Implementation Method 3
The catalysts facilitate initiation and subsequent deposition of electroless metals (e.g., copper, tin, etc.) from solutions of metal salts
Implementation Method 4
The ablation can be performed by use of UV, CO2, YAG, excimer laser, mechanical trimmer, or other appropriate means
Data Source
AI summary
Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.