High Voltage Circuit Adaptations TRIZ Cases

A spiral conductor around a magnetic bar boosts inductance for lightning surge protection while shrinking bulky PCB coil layouts.

A bracket between the PCB and circuit breaker maintains terminal spacing, avoids complex board cutouts, and preserves electrical contact.

Closely spaced PCB layers form a meandered clamping path that lowers inductance while preserving resistance and thermal capacitance.

A sleeve seal with an added creepage section blocks moisture and dirt while extending insulation distance in compact high-voltage connectors.

A shared NMOS discharge path and diode-linked node protect multiple power domains from positive and negative ESD events with less circuit complexity.

Adhesive-bonded conductive and insulating layers ease thermal stress, prevent cracking, and reduce partial discharge in power modules.

Vertical power delivery between opposite substrates shortens chip supply links, reducing impedance and voltage fluctuation while improving current balance.

Symmetrical solder pads reduce module tilting during PCB soldering, keeping air gaps uniform for washing, underfill, and heat transfer.

Insulating pad patterns and adjusted lead spacing help ACF escape trapped air during thermal compression, improving panel-to-film bonding reliability.

An extended ground layer reaches the insulating board contour end, giving static electricity a controlled path away from the touch sensor board.

A passive capacitor beneath segmented bottom-emitting OLEDs increases capacitance and helps dissipate ESD energy.

A voltage regulator module uses a separate heat sink to dissipate thermal energy from power components.

A short-circuit wiring line connects lead lines to equalize potential, eliminating conductive tape and preventing electrostatic discharge damage.

An insulative cover directly fixes a high voltage circuit board to a main frame, resolving the trade-off between electrical insulation and apparatus size.

Through holes and patterned conductive layers facilitate point discharge to prevent IC damage without increasing layout area or manufacturing costs.

Multi-layer printed circuit board integrates planar sensor coils to measure currents at different potentials while maintaining electrical isolation.

A printed circuit board design adjusts differential line lengths to balance capacitance values between conductors and ground layers.

Low-potential ground wiring detects ink penetration in flexible printed circuit boards, preventing short circuits without compromising flexibility.

An electrostatic protection circuit uses separate time constants to control discharge timing and prevent mis-operation during power activation.

Chemical separation using a plating blocker prevents mechanical damage during 3D circuit formation, ensuring precise layer isolation.

Cured resin composition containing phase change material and filler materials enhances structural rigidity and thermal management in compact electronic devices.

Segmented electrostatic protection structures route charge away from sensitive components, enhancing reliability without adding manufacturing complexity.

Dual seed metal layers and recessed portions eliminate undercut defects while improving insulating layer adhesion.

Mechanical tabs replace chemical adhesives on dielectric barriers, eliminating heat-induced adhesive failures and reducing manufacturing costs.

A voltage surge attractor with a conical frustum and spherical cap diverts electrostatic discharge energy to chassis ground.

Vent holes in the printed wiring board channel air through a transformer space to suppress temperature rise of the power supply IC.

A semiconductor module uses an extended metal layer to alter equipotential lines and reduce electrical field intensity at circuit board edges.