Display Pad Layout for Bubble-Resistant ACF Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face issues with the formation of air bubbles in the anisotropic conductive film (ACF) during thermal compression, which affects the bonding of the printed circuit film and display panel.
Innovation Solution
The display device incorporates insulating patterns and lead wires with varying widths and configurations to minimize the distance between lead portions, allowing the ACF to make contact with the sides of these features, thereby reducing air bubble formation during thermal compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the ACF is thermally compressed to bond the lead wires and signal wires, then electrical connection is achieved, but air bubbles are generated in the ACF
Solution Approach 1:
The insulating patterns are pre-formed on the base substrate before ACF bonding, creating a structured surface that guides ACF material flow and prevents air bubble formation during subsequent thermal compression. The lead wires are also pre-positioned with specific spacing arrangements that facilitate air evacuation during bonding.
Solution Approach 2:
The insulating patterns act as intermediary structures between the base substrate and the ACF, providing a controlled interface that manages material flow and pressure distribution during thermal compression, thereby preventing air bubble entrapment while maintaining reliable electrical connections.
2Productivity
If the distance between lead wires is reduced to minimize ACF contact distance, then bonding efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The insulating patterns provide localized structural features at specific positions between lead wires, creating zones with different properties. The patterns are strategically placed to facilitate ACF flow in critical areas while maintaining appropriate spacing in other regions, thereby reducing overall contact distance without uniformly increasing precision requirements across the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the generation of air bubbles in the ACF, enhancing the bonding process and improving the reliability of the connection between the printed circuit film and display panel.
Implementation Method 1
thermal compression of the ACF
Implementation Method 2
the leads may be bonded to the pads via an anisotropic conductive film (ACF) disposed between the pads
Data Source
AI summary
A display device includes, among other things, a pad area having a pattern that may reduce the distance gab between the signal lines cause by the contour changes of the signal lines. A corresponding print circuit board may also include a similar pattern to assimilate the distance gap between the lead wires. The pad and print circuit board may contact through anisotropic conductive film.