Vertical Power Module Circuit Board Assembly for Current Balance
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Solution Overview
Problem
The existing power supply solutions for high computing power chips face issues of current imbalance, long power supply links leading to high impedance and inductance, resulting in voltage fluctuations and reduced computing performance.
Innovation Solution
A circuit board assembly design with substrates on opposite sides and integrated power modules, including voltage regulators and capacitors, to vertically supply power, reducing link length and improving current balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a long power supply link is used to supply power to the chip, then the power supply can reach the chip, but the impedance and inductance increase, causing voltage fluctuations
Solution Approach 1:
The patent transitions from a planar power supply layout to a three-dimensional stacked architecture. The power supply component is placed on a first substrate while the chip is placed on a second substrate positioned above it, with vertical connection members providing power supply through the thickness direction. This dimensional change dramatically shortens the power supply link length and reduces impedance and inductance, thereby improving voltage stability.
2Ease of manufacture
If the power supply link is lengthened to accommodate component layout, then component placement is easier, but current imbalance and voltage fluctuation worsen
Solution Approach 1:
By utilizing the vertical dimension with stacked substrates, the patent enables independent optimization of component placement on each substrate while maintaining short power supply paths. The power supply component and chip are positioned on different substrates, allowing flexible layout design without compromising current balance or increasing link length.
Solution Approach 2:
The connection members serve as intermediaries between the power supply component on the first substrate and the chip on the second substrate. These vertical connectors provide direct, low-impedance power delivery paths, enabling current balance while accommodating flexible component placement across multiple substrate layers.
3Device complexity
If power supply components are placed far from the chip, then routing is simpler, but inductance and voltage fluctuation increase
Solution Approach 1:
The patent resolves routing complexity by utilizing the vertical dimension. Instead of requiring long lateral traces on a single substrate, the power supply component and chip are positioned on vertically stacked substrates with direct vertical connections. This approach simplifies routing while minimizing inductance and maintaining voltage stability through the shortened power delivery path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces impedance and inductance by up to 30%, stabilizes voltage, and enhances computing performance by minimizing voltage fluctuations and power consumption.
Implementation Method 1
The first power module may be configured to perform regulating and filtering on a voltage input by the input terminal, and then output a voltage to the output terminal
Implementation Method 2
The first power module may include a voltage regulator module and one or more filter capacitors
Implementation Method 3
The conductive member is an elastic conductive member, and the conductive member elastically abuts against the input terminal of the first power module
Data Source
AI summary
A circuit board assembly includes a first substrate, a second substrate, a chip, and a first power module. The first substrate and the second substrate are disposed opposite to each other and at an interval. A power supply component and a conductive member are disposed on a first surface that is of the first substrate and that faces the second substrate. The chip is disposed on a first surface that is of the second substrate and that faces away from the first substrate, and the first power module is disposed on a second surface that is of the second substrate and that faces the first substrate. An input terminal is disposed on a surface that is of the first power module and that faces the first substrate. An output terminal is disposed on a surface that is of the first power module and that faces the second substrate.