Resin Composition with Phase Change Material for Small Devices
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Solution Overview
Problem
Small form factor electronic devices face challenges in achieving structural rigidity, thermal performance, safety, and fast charging due to size constraints, which can lead to increased fragility, thermal issues, and safety concerns in explosive environments.
Innovation Solution
The use of multiple resin compositions with thermal energy storage, thermal conductivity, strengthening, and softening filler materials within the device housing to enhance structural integrity, thermal management, and safety, including phase change materials, metal oxides, glass fibers, and closed foam balls, which are strategically positioned and cured to provide adhesion, thermal capacitance, and impact resistance without requiring different manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the device size is reduced to improve portability, then the device becomes more portable, but the device becomes more structurally flexible and fragile
Solution Approach 1:
The patent applies composite materials by integrating multiple filler types (glass fibers for reinforcement, metal particles for conductivity, foam particles for cushioning) within a single resin composition. This allows the housing material itself to provide structural rigidity, thermal management, and impact resistance without requiring separate structural components, thereby maintaining strength while reducing overall device size.
2Device complexity
If fanless design is used to reduce component count and size, then the device size is reduced, but thermal performance deteriorates
Solution Approach 1:
The patent changes the thermal parameters of the housing material by incorporating filler particles with high thermal conductivity (such as metal particles). This transforms the housing from a simple structural element into an active thermal management component that conducts heat away from internal components, enabling fanless operation while maintaining acceptable thermal performance.
Solution Approach 2:
The housing material is designed to perform multiple functions simultaneously: structural support, thermal conduction, and impact absorption. By making the housing multi-functional, the patent eliminates the need for separate cooling fans and structural braces, reducing component count while maintaining thermal performance.
3Length of stationary object
If device thickness is reduced to improve portability, then the device becomes thinner and more portable, but the device becomes more easily damaged upon impact
Solution Approach 1:
The patent applies local quality by distributing different types of filler particles throughout the resin composition to provide localized functions. Foam particles are distributed to provide impact cushioning in specific regions, while glass fibers provide reinforcement throughout. This allows the thin housing to resist impact damage without requiring additional protective layers or increasing overall thickness.
4Length of moving object
If smaller form factor is used to improve portability, then the device becomes more portable, but safety concerns increase in explosive environments
Solution Approach 1:
The resin composition acts as an inert barrier material that isolates internal electronic components from the external environment. This encapsulation prevents sparks or heat generated by internal components from igniting explosive atmospheres outside the device, thereby maintaining safety in hazardous environments while allowing compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in increased structural rigidity, improved thermal performance, enhanced safety by preventing ignition sources, and faster charging capabilities while maintaining device portability and reducing the need for additional structural components.
Implementation Method 1
The resin composition includes a phase change material
Implementation Method 2
The resin composition includes a thermal conductivity filler material
Implementation Method 3
The resin composition includes a thermal energy storage material
Data Source
AI summary
Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.