Semiconductor Module Edge Field Reduction via Metal Layer Extension
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Solution Overview
Problem
Conventional semiconductor modules experience high electrical field intensity at the edge portions of the circuit board, leading to potential partial discharge and breakdown of the insulative plate, which can degrade the module's performance.
Innovation Solution
A semiconductor module design featuring a laminate substrate with an insulative plate, a circuit board, and a metal plate, where the insulative plate extends beyond the circuit board's edge and an interconnecting substrate with a metal layer overlapping the circuit board's edge, reducing the electrical field intensity by altering the equipotential lines and preventing them from concentrating at the edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the interval between the edge portions of the ceramics layer and the edge portions of the circuit board is made smaller, then the electrical field intensity at the edge portions of the circuit board is reduced, but the insulative performance and reliability are compromised
Solution Approach 1:
The patent introduces a metal layer as an intermediary component between the circuit board and the ceramics layer. This metal layer serves as a mediator that redistributes the electrical field, preventing direct concentration at the circuit board edges while maintaining adequate insulation. The metal layer acts as a buffer zone that manages the electrical field distribution without compromising the insulative performance of the ceramics layer.
Solution Approach 2:
The patent extends the solution from a two-dimensional planar arrangement to a three-dimensional structure by adding the metal layer that protrudes from the ceramics layer toward the circuit board. This vertical dimensionality allows the electrical field to be managed in the thickness direction, creating a more effective field distribution that reduces edge intensity while preserving insulation through the extended metal structure.
2Object-affected harmful factors
If the metal layer extends beyond the circuit board edge, then the electrical field intensity is reduced through altered equipotential lines, but the device complexity increases
Solution Approach 1:
The metal layer is designed to serve multiple functions simultaneously: it acts as an electrical field management element, provides structural support, and maintains electrical connectivity. By making the metal layer extend beyond the circuit board edge, it universally addresses both the field intensity reduction and the structural integrity requirements, reducing the need for additional specialized components.
Solution Approach 2:
The patent merges the electrical field management function with the existing metal layer structure. Instead of adding a separate dedicated component for field management, the design combines this function with the metal layer that is already part of the laminate substrate structure, thereby reducing overall device complexity while achieving the desired electrical field distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the electrical field intensity at the circuit board's edges, preventing partial discharge and maintaining the insulative properties of the semiconductor module, thereby ensuring reliable operation.
Implementation Method 1
the metal layer has a region overlapping the outer edge portion of the circuit board and extends more outside than the outer edge portion of the circuit board... reducing the electrical field intensity by altering the equipotential lines and preventing them from concentrating at the edges
Data Source
AI summary
It is aimed to reduce the electrical field intensity at a laminate substrate on which a semiconductor device is placed. A semiconductor module includes a laminate substrate including an insulative plate, a circuit board provided on a first surface of the insulative plate and a metal plate provided on a second surface that is opposite to the first surface, and an interconnecting substrate that is provided so as to oppose the laminate substrate and that includes a metal layer. Here, the insulative plate extends more outside than an outer edge portion of the circuit board, and the metal layer has a region overlapping the outer edge portion of the circuit board and extends more outside than the outer edge portion of the circuit board.