Control Device Thermal Management via PCB Vent Holes
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Solution Overview
Problem
Conventional switching power supply circuits face challenges in miniaturization and high density due to hindered heat dissipation of the power supply IC, especially when mounted near a mounting plate.
Innovation Solution
A control device design where the switching transformer and power supply IC face each other with a printed wiring board interposed, featuring vent holes and pedestals to facilitate air flow and heat dissipation, with the power supply IC mounted to face at least part of the transformer, and through-holes providing electrical continuity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the switching power supply IC is mounted on a printed wiring board with a mounting plate nearby, then the mounting area is reduced and high density is achieved, but heat dissipation of the power supply IC is hindered
Solution Approach 1:
The invention utilizes the vertical dimension by forming a predetermined space between the switching transformer and the first surface of the printed wiring board using a pedestal. This three-dimensional space allows heat to dissipate vertically away from the power supply IC, resolving the heat dissipation issue while maintaining the high-density two-dimensional mounting layout.
Solution Approach 2:
The pedestal acts as an intermediary structure that creates a thermal pathway. It forms a predetermined space that facilitates heat flow from the power supply IC through the printed wiring board to the switching transformer, enabling effective heat dissipation without requiring additional mounting space.
2Volume of moving object
If the switching transformer and power supply IC are mounted facing each other on opposite surfaces of the printed wiring board, then miniaturization and high density are achieved, but heat generated by the power supply IC accumulates around it
Solution Approach 1:
The invention extracts the heat from the confined space around the power supply IC by creating a predetermined space between the switching transformer and the printed wiring board. This extracted space allows heat to be carried away by air flow through vent holes, preventing heat accumulation while maintaining compact device dimensions.
Solution Approach 2:
The invention introduces air flow through vent holes in the printed wiring board to carry heat away from the power supply IC. The air moves through the predetermined space formed by the pedestal, creating a pneumatic cooling system that removes heat efficiently without requiring additional mechanical cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves miniaturization and high density of the printed wiring board while effectively suppressing excessive temperature rise of the power supply IC through enhanced air flow and heat dissipation.
Implementation Method 1
the air with increased temperature flows through the plurality of holes into the predetermined space on the switching transformer side
Implementation Method 2
the through-hole is used not only as a hole through which air flows, but also conducts heat on the second surface side to the first surface side through the through-hole
Data Source
Figure 1
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Figure 4
AI summary
Provided is a control device including a printed wiring board in consideration of heat dissipation of a power supply IC. In the control device (60), a transformer (41) forms a heat dissipation space (450) with a first surface (51a) of the printed wiring board (51), and is mounted on the first surface (51a). Furthermore, the power supply IC (43) is mounted on a second surface (51b) of the printed wiring board (51) so as to face at least a part of the transformer (41). Further, the printed wiring board (51) has a plurality of vent holes (511) at locations facing the transformer (41) and at locations facing the power supply IC (43), the plurality of vent holes (511) leading to the heat dissipation space 450.