Electronic Device Electrostatic Protection Structure

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Solution Overview

Problem

Electronic devices face reliability issues due to electrostatic discharge (ESD) during manufacturing processes such as component bonding, cutting, and laminating, which can damage components and affect device performance.

Innovation Solution

An electronic device is designed with a conductive ring and an electrostatic protection structure electrically connected to the conductive ring. The electrostatic protection structure includes line end portions connected to conductive pads and the conductive ring, allowing electrostatic discharge to be directed away from sensitive components to the ground potential.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional manufacturing processes are used without electrostatic protection, then manufacturing simplicity is maintained, but component reliability deteriorates due to electrostatic discharge damage

Engineering Contradiction:

Improvecomponent reliabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The electrostatic protection structure is segmented into multiple functional parts: first conductive pads for charge collection, first conductive rings for charge distribution, and first electrostatic protection structures for charge dissipation. Each segment performs a specific function in the electrostatic discharge pathway, allowing the protection mechanism to be integrated into existing manufacturing processes without requiring complete process redesign

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first conductive rings act as intermediary elements between the first conductive pads and the ground potential. They provide a controlled pathway for electrostatic discharge, mediating the charge dissipation process and preventing direct discharge that would damage sensitive components. This intermediary structure enables electrostatic protection while maintaining compatibility with traditional manufacturing processes

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If electrostatic protection structures are added to protect components, then component damage from ESD is reduced, but manufacturing process complexity increases

Engineering Contradiction:

Improvecomponent reliabilityVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The electrostatic protection structures are merged with the existing conductive pad and conductive ring structures in the display device. By combining the electrostatic protection function with existing manufacturing elements, the patent avoids adding separate, complex protection mechanisms. The first conductive pads and rings that are already part of the device architecture are enhanced to provide electrostatic discharge pathways, integrating protection into the manufacturing process rather than adding separate steps

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The first conductive pads and first conductive rings serve multiple functions: they provide electrical connectivity for device operation and simultaneously serve as electrostatic discharge pathways. This multi-functionality eliminates the need for dedicated electrostatic protection components and processes, maintaining manufacturing simplicity while providing comprehensive ESD protection across different device regions

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces component damage from electrostatic discharge, enhancing the reliability and performance of electronic devices while simplifying the manufacturing process by not requiring a semiconductor layer in the electrostatic protection structure.

Implementation Method 1

These electrostatic discharge (ESD) may cause damage to components in electronic devices

Methodology Applied

Scientific EffectElectrostatic discharge: Electrostatic Discharge

Implementation Method 2

The first conductive ring is electrically connected to a ground potential

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250176088A1Electronic device

Publication Date: 2025.05.29 INNOLUX CORP

AI summary

An electronic device is provided. The electronic device includes a first panel including a first substrate, a second substrate, a plurality of first conductive pads, a first conductive ring, and a first electrostatic protection structure. The first substrate includes a first electronic component bonding area. The second substrate is disposed opposite to the first substrate. The plurality of first conductive pads are disposed on the first electronic component bonding area. The first conductive ring is disposed on the first substrate. The first electrostatic protection structure includes a first line end portion and a second line end portion that are opposite to each other. The first line end portion is connected to one of the plurality of first conductive pads. The second line end portion is connected to the first conductive ring. Moreover, the first conductive ring is electrically connected to a ground potential.