Circuit Substrate With Uneven Insulator Wall For Adhesion
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Solution Overview
Problem
The existing technologies for mounting electronic components on substrates face issues with defects due to 'bringing-back' of components, which reduces the yield and holding force, particularly when using paste-like bonding materials in cavities.
Innovation Solution
A circuit substrate with an insulator wall having an uneven inner surface, increasing the surface area to securely hold adhesive and prevent air entrainment, thereby reducing the likelihood of component displacement during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a paste-like bonding material is used to mount electronic components in a cavity, then the mounting process can be simplified, but the electronic component may be brought back by the holding member, reducing yield
Solution Approach 1:
The inner side surface of the wall is designed with uneven portions that create curved and irregular surfaces. This curvature increases the surface area and allows the bonding material to conform to the surface, improving adhesion and preventing component bringing-back while maintaining process simplicity
Solution Approach 2:
The uneven portions on the inner side surface create a porous-like structure that increases surface area. This allows the bonding material to penetrate and anchor into the unevenities, providing mechanical interlocking that prevents component displacement during mounting
2Ease of manufacture
If the inner side surface of the wall is made smooth, then the manufacturing process is simpler, but the bonding material has reduced adhesion and allows component bringing-back
Solution Approach 1:
Instead of a smooth flat surface, the wall inner side is given uneven portions with curved surfaces. This increases the effective bonding area and provides mechanical anchoring points for the bonding material, significantly improving adhesion strength while remaining manufacturable
Solution Approach 2:
The inner side surface is transformed from a two-dimensional flat plane to a three-dimensional uneven surface with varying heights and contours. This dimensional change increases the surface area available for bonding and creates mechanical interlocking features that enhance adhesion
3Reliability
If air is entrained between the inner side surface and bonding material, then the bonding effectiveness is reduced, but preventing air entrapment requires additional process complexity
Solution Approach 1:
The uneven curved surfaces on the inner side of the wall help to trap and eliminate air bubbles during the bonding material application process. The curved geometry guides air escape paths and ensures complete contact between the bonding material and wall surface, improving bonding effectiveness without adding process steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased surface area and specific arrangement of uneven portions on the substrate's inner surface effectively prevent component 'bringing-back' and enhance the yield by ensuring better adhesion and holding force, even when air is present.
Implementation Method 1
when a constituent material such as an adhesive is disposed inside the wall, the constituent material is held on the inner side surface having a large surface area
Data Source
AI summary
A circuit substrate is a circuit substrate having at least one pair of terminals, wherein a bonding material containing a metal element is disposed above the terminals, the pair of terminals and the bonding material are disposed inside a wall formed by an insulator, and the wall has an uneven portion on an inner side surface.