Insulated Circuit Substrate Layout to Reduce Warping and Cracking
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Solution Overview
Problem
The semiconductor device experiences warping and cracking due to thermal expansion coefficient differences between ceramic and metal components, leading to reduced thermal conductivity and insulating properties, affecting long-term reliability.
Innovation Solution
The semiconductor device incorporates a resin layer with a circuit pattern and base plate, where semiconductor chips are spaced inwardly from the circuit pattern's edge, and a case surrounds the circuit pattern and semiconductor chip, with a sealing material covering the substrate, minimizing thermal expansion coefficient differences and preventing heat interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic plate is used as the base plate in the insulated circuit substrate, then high thermal conductivity and insulating property are achieved, but warping occurs due to thermal expansion coefficient differences between the ceramic plate and the circuit pattern/metal plate
Solution Approach 1:
The patent changes the material parameter of the base plate from ceramic to resin, which has a thermal expansion coefficient closer to that of the circuit pattern and metal plate. This parameter change reduces the thermal expansion mismatch, thereby minimizing warping during heat cycling while maintaining the structural integrity and reliability of the insulated circuit substrate.
Solution Approach 2:
The patent employs a composite structure where the resin base plate is combined with circuit patterns and metal plates to create an insulated circuit substrate that balances thermal expansion properties across different materials. This composite approach allows the assembly to expand and contract more uniformly during temperature changes, reducing warping and improving long-term reliability.
2Area of stationary object
If the semiconductor chip is bonded close to the edge of the circuit pattern, then space utilization is maximized, but heat interference and thermal stress concentration occur at the edges
Solution Approach 1:
The patent applies local quality by creating a spaced arrangement where the semiconductor chip is positioned inward from the edge of the circuit pattern by a predetermined distance. This local spacing strategy concentrates heat management resources (such as heat dissipation paths and stress distribution zones) in critical areas, reducing heat interference and thermal stress concentration at the edges while maintaining efficient space utilization.
3Reliability
If the circuit pattern extends to the edge of the base plate, then electrical connectivity is maximized, but cracks may occur in the ceramic plate during repeated heat cycling
Solution Approach 1:
The patent applies preliminary action by designing the circuit pattern with a predetermined distance from the edge of the resin base plate before assembly and heat cycling occur. This pre-planned spacing creates a buffer zone that prevents stress concentration at the edges during subsequent thermal cycles, thereby preventing crack formation while maintaining adequate electrical connectivity through the circuit pattern design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces warping and maintains heat dissipation performance, enhancing the long-term reliability of the semiconductor device by ensuring effective heat transfer and insulation.
Implementation Method 1
differences in thermal expansion coefficient between the ceramic plate and the circuit pattern and between the ceramic plate and the metal plate. Therefore, the insulated circuit substrate is warped by heat generated by the semiconductor chips
Implementation Method 2
a sealing material which covers the insulated circuit substrate and the semiconductor chip and is surrounded by the case
Implementation Method 3
reduces warping and maintains heat dissipation performance, enhancing the long-term reliability of the semiconductor device by ensuring effective heat transfer and insulation
Data Source
AI summary
A semiconductor device includes: an insulated circuit substrate including a base plate, a resin layer on the base plate, and a circuit pattern on the resin layer; a semiconductor chip that is rectangular and is bonded to the circuit pattern such that a side edge of the semiconductor chip is spaced inwardly from an outer peripheral edge of the circuit pattern by a predetermined distance; a case on the resin layer and surrounds the circuit pattern and the semiconductor chip; and a sealing material that covers the insulated circuit substrate and semiconductor chip and is surrounded by the case. The predetermined distance and thickness of the circuit pattern are greater than or equal to 0.1 of a length of one side of the semiconductor chip. A peripheral region of the case and a peripheral region of the resin layer are connected to each other via an adhesive layer.