Circuitized Substrate for Stacked Die Thermal Management

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Solution Overview

Problem

Existing stacked die and substrate structures face limitations in packing density and thermal management, particularly for high-power and low-power chips, as they lack effective cooling mechanisms and efficient interconnects, leading to restricted power dissipation and mechanical handling issues.

Innovation Solution

A stacked semiconductor apparatus with a circuitized substrate serving as both an electrical interconnection device and a heat spreading lid, facilitating cooling through cross-flow of a cooling medium and utilizing thermal interface materials or coolant paths for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If vertically stacked die and substrate structures are formed to increase packing density, then circuit density is improved, but thermal management capability deteriorates due to lack of effective cooling mechanisms

Engineering Contradiction:

Improvecircuit densityVSAvoidthermal management capability

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The circuitized substrate serves dual functions as both an electrical interconnection device and a heat spreading lid. The substrate includes circuitry for electrical connections and integrated cooling channels for thermal management, allowing a single component to perform multiple functions that were previously required separate elements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

A thermal interface material is introduced as an intermediary between the die and the circuitized substrate to enhance heat transfer. This mediator improves the thermal coupling between the heat-generating die and the cooling channels in the substrate, facilitating more effective heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If micro-miniature heat sink devices are attached to high-power chips to provide cooling capability, then thermal management is improved, but packing density deteriorates because undersides of substrates are not array interconnected

Engineering Contradiction:

Improvecooling capabilityVSAvoidpackening density

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The circuitized substrate integrates both interconnection and cooling functions into a single component. The substrate provides electrical connections through its circuitry while simultaneously serving as a heat spreader with integrated cooling channels, eliminating the need for separate heat sink devices attached to chip undersides.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling channels are merged directly into the substrate structure itself rather than being separate attached components. The substrate is designed with internal passages for coolant flow, combining the interconnection substrate and cooling system into one integrated element that maintains high packing density.

Inventive Principle:

Principle #5Merging (Combining)

3Quantity of substance

If folded layer designs are used in organic packages to achieve vertical stacking, then packing density is improved, but mechanical handling behavior deteriorates due to poor mechanical properties of flexible films

Engineering Contradiction:

Improvepacking densityVSAvoidmechanical handling behavior

Core Design Contradiction:

Quantity of substanceVSStrength

Solution Approach 1:

The package structure transitions from flexible films to rigid circuitized substrates. This parameter change in material rigidity improves mechanical handling behavior while maintaining the vertical stacking configuration for high packing density. The rigid substrate provides structural stability without sacrificing the space-efficient vertical arrangement.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves increased packing density and improved thermal management, enabling higher power dissipation and robust mechanical handling by providing efficient electrical interconnects and effective cooling mechanisms for both high-power and low-power chips.

Implementation Method 1

a first circuitized substrate attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS7611923B2Method and apparatus for forming stacked die and substrate structures for increased packing density

Publication Date: 2009.11.03 BEIJING ZITIAO NETWORK TECH CO LTD

AI summary

A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.