Cleaning Assembly for Wafer Suction Surface Maintenance

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Foreign matter adhering to the suction surface of a conveying unit in a processing apparatus can damage wafers during processing, as it gets sandwiched between the chuck table and the suction surface.

Innovation Solution

A cleaning assembly with a substrate and a cleaning member, such as a sponge or brush, is used to clean the suction surface of the conveying unit, preventing foreign matter from adhering and thus protecting the wafers from damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a suction surface is used to convey wafers, then wafer conveyance reliability is improved, but foreign matter adheres to the suction surface causing wafer damage

Engineering Contradiction:

Improvewafer conveyance reliabilityVSAvoidforeign matter adhesion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The cleaning member is positioned to contact the suction surface before wafer placement, performing preliminary cleaning action to remove foreign matter adhering to the suction surface, thereby preventing wafer damage while maintaining conveyance reliability

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A cleaning member acts as an intermediary element between the suction surface and the wafer, contacting the suction surface to remove foreign matter without directly contacting the wafer, thus preventing foreign matter damage to wafers

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the suction surface is cleaned frequently, then foreign matter adhesion is reduced, but device complexity increases

Engineering Contradiction:

Improveforeign matter adhesionVSAvoidcleaning assembly complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The cleaning assembly is designed to be self-contained with the cleaning member integrated on the substrate, allowing the suction surface to be cleaned without requiring external cleaning equipment or complex mechanisms, thus reducing overall device complexity while maintaining effective cleaning

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents wafer damage by effectively removing foreign matter from the suction surface, ensuring safe conveyance and processing of wafers.

Implementation Method 1

a suction surface including a plate-like porous member for sucking the back surface of the wafer

Methodology Applied

Scientific EffectSuction: Suction

Implementation Method 2

a cleaning member disposed on an upper surface of the substrate. The suction surface of the conveying unit is cleaned by an action of the cleaning member

Methodology Applied

Scientific EffectMechanical contact cleaning: Brush

Data Source

PatentUS20230115306A1Cleaning assembly

Publication Date: 2023.04.13 DISCO CORP

AI summary

A cleaning assembly includes a substrate having a lower surface to be held on a holding unit disposed in a processing apparatus and a cleaning member disposed on an upper surface of the substrate. A suction surface of a conveying unit is cleaned by an action of the cleaning member in a state in which the cleaning assembly is held on the holding unit.