Multi-Layer Cleaning Pad for Semiconductor Probe Card Contact Elements
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Solution Overview
Problem
Conventional methods for cleaning contact elements and support hardware in semiconductor testing are inefficient, leading to premature wear, increased costs, and unreliable electrical contact due to debris accumulation and non-uniform abrasive wear, which affects the yield and reliability of IC device testing.
Innovation Solution
A cleaning pad with multiple layers of different materials and predetermined geometrical features, along with surface treatments, is used to effectively remove debris from contact elements during normal testing operations, maintaining the shape and performance of the contact elements without interrupting the testing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional cleaning methods are used to remove debris from contact elements, then debris removal is achieved, but contact elements experience premature wear and non-uniform abrasive wear
Solution Approach 1:
The patent changes the physical and chemical parameters of the cleaning pad materials, using multiple layers with different hardness, porosity, and abrasive properties to achieve effective debris removal while minimizing wear on contact elements
Solution Approach 2:
The cleaning system uses composite material structure with multiple layers including abrasive layers, non-abrasive layers, and intermediate layers, each with specific material properties that work together to remove debris without causing premature wear to contact elements
2Reliability
If cleaning operations are performed to maintain contact element performance, then electrical contact reliability is improved, but equipment downtime increases
Solution Approach 1:
The cleaning pad is pre-installed in the testing equipment, allowing cleaning to occur automatically during normal testing operations before debris accumulation becomes problematic, thus maintaining reliability without requiring separate cleaning downtime
Solution Approach 2:
The cleaning operation continues continuously during normal testing operations through the interaction of contact elements with the cleaning pad surface, eliminating the need to stop equipment for separate cleaning cycles and maintaining continuous productive action
3Object-affected harmful factors
If abrasive cleaning materials are used to remove debris, then debris removal effectiveness is improved, but contact element geometry is degraded
Solution Approach 1:
The cleaning pad uses localized abrasive particles embedded in a matrix with controlled distribution and size, providing targeted cleaning action only where needed while the surrounding non-abrasive material protects contact element geometry
Solution Approach 2:
The patent carefully controls the parameters of abrasive particles including size, hardness, and distribution density to achieve effective debris removal while minimizing geometric degradation of contact elements through optimized abrasive action
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides consistent and predictable debris removal, extending the service life of contact elements, reducing equipment downtime, and maintaining high yield and low contact resistance, thereby improving the reliability and efficiency of IC device testing.
Implementation Method 1
A cleaning pad with multiple layers of different materials and predetermined geometrical features, along with surface treatments, is used to effectively remove debris from contact elements
Data Source
AI summary
A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.