Edge Grinding Machines TRIZ Cases

Synchronous grinding and deburring machine processes valve spools using CCD-based industrial visual cameras for precise edge control.

Grind common liquid crystal panels into irregular shapes and seal exposed edges with resin to reduce production costs.

Movable abrasive means form independent curvatures on sapphire blanks, enabling series production of asymmetrical crystals with reduced reject rates.

A cup attaching apparatus uses a moving mechanism to adjust support pin distance from the central axis for secure lens mounting.

A centrifugal separator with an upper filter and drain pipe treats grinding water, resolving inefficiencies in separating refuse.

Segmented polishing stages with abrasive-free media remove adhering alumina powder and reduce surface roughness to Ra 0.02 μm.

A spectrally encoded endoscopy probe transmits one-dimensional images via a single optical fiber using spectral encoding optics.

Independent five-axis control enables precise treatment of complex shapes and micro-details, resolving bulk collision issues.

Inverting electromagnetic linear motors above grinding wheels directs coolant downward, preventing debris penetration and thermal deviations.

A fan-type grinding wheel uses bent abrasive elements to create a peripheral working face alongside the main planar surface for versatile machining.

Segmented polishing stages and local contact area adjustments resolve roughness and inclination trade-offs on vertical and horizontal surfaces.

Visual guidance aligns adhesive labels within final contours, preventing edging tool contact and machining defects.

Dual cutting units remove wafer chamfers while liquid barriers prevent swarf adhesion.

A control system calculates drilling angles from demo lens curves to process rimless frame holes.

A disk-shaped polishing member with a completely round edge positions itself on the wafer to polish the outer circumferential area.

Elastic spindle holding tilts grinding stones to equalize axial and exit displacements, reducing workpiece defects and stone wear.

Integrating a direct drive motor in an annular space lowers the swivel head height, suppressing inclination caused by grinding resistance.

A polishing apparatus sequences front and back surface rinse liquid delivery using timed delays to clean the substrate.

Dynamic torque control suppresses axis deviation in slippery liquid-repellent lenses by adjusting holding force during high-speed processing.

An aspirating device creates a vacuum within a stripping volume to collect abrasive particles, eliminating manual cleaning downtime during film removal.

A single drive motor rotates and oscillates a grinding roller through an integrated cam mechanism.

A chamfering table flatness measurement method uses substrate edge symmetry to determine wheel height deviations.

Repeated cutting steps create a stepped oblique region to reduce off-cut volume and enable automated collection during grinding.

Fluidizing unit agitates workpieces while suction unit directs abrasive flow, preventing scattering and improving surface finishing quality.

Index-fed abrasive sheets polish probes in multiple positions, reducing apparatus size and polishing time.

A color image sensor detects polishing tape changes to determine the wafer polishing end point.

Composite cleaning pads with controlled abrasive layers remove debris from probe card contacts to prevent premature wear and maintain electrical reliability.

Normal-temperature bonding fixes diamond tips to super hard bodies, eliminating thermal expansion errors during manufacturing.

A preparation device positions ophthalmic lenses using marker image acquisition and processor control.

A substrate processing apparatus maintains constant tape tension by adjusting recovery motor torque based on calculated roll diameter.

Continuous curved chamfers on projected corner columns match embossed surface patterns, eliminating visible flat transitions and adhesive protrusion artifacts.

A hand operated grinding tool with a conical head and collet system finishes tube surfaces.

Variable radial height of the mounting rib eliminates visible gaps and improves fitting precision.

A bevel formation data setting device acquires rim information to display a corresponding setting screen for lens processing.

A skate blade sharpening machine uses a movable contouring tool to grind the periphery of a rotating grinding wheel and define its profile.

Porous rollers and fibrous surfaces harbor debris to eliminate scratching and burnishing during precise angle control.

Segmented components with feedback control increase brick pushing frequency while maintaining synchronization accuracy.

Centrifugal separation removes silt from process water in a closed loop, maintaining high clarity and extending service life without frequent changes.

Rotating the magnetic field generator replaces complex mechanical movement systems, improving polishing efficiency for complex 3D geometries.

Heating members warm the polishing pad while suction ports remove steam to prevent condensation and particle generation.

Dicing blades form substrate grooves while isotropic etching sharpens tips, resolving breakage risks at the needle base.

Lateral grooves on a rotating cylindrical grinding part enable precise hole formation at substrate edges, reducing wear and extending apparatus lifetime.

Chelating metal ions with organic acid reduces dishing and erosion while maintaining high polishing efficiency.

Mechanical polishing removes cutting defects from laminated glass edges, achieving over 400 MPa strength without chemical etching costs.

A two-stage LED wafer processing method uses diamond abrasive blades to divide sapphire substrates into individual chips.

A blowing element directs a gas stream onto a rotating grinding wheel to maintain operational temperature during glass panel stripping.

A cutting device integrates a cleaning member that advances and recedes with the blade to clean the electrode cutting section.

Intermediate cleaning units remove polishing debris between peripheral and CMP stages, preventing scratches while maintaining high manufacturing precision.

Imaging units capture concave reference marks to calculate convex mounting positions, resolving parallax errors during lens shape processing.

Dual resilient disc bodies adapt to travel path deviations, ensuring homogeneous beveling and preventing corner cracks.