Cleanspace Fabricator for Customized Smart Devices

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Solution Overview

Problem

Existing cleanroom designs for advanced technology fabrication are inefficient and costly due to increased volume and complexity, requiring separate facilities for different cleanliness levels and processing steps, which hinders rapid production of customized smart devices and touchscreen devices with integrated encryption capabilities.

Innovation Solution

The use of cleanspace fabricators that enable processing of high technology products from wafer substrates to final packaging in a single environment, employing additive manufacturing and 3DIC techniques, allowing for customized smart devices with integrated encryption and dual-touchscreen capabilities, and enabling efficient integration of components like batteries and fuel cells.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional cleanroom design is used with increased volume and separate facilities for different cleanliness levels, then processing capability is improved, but cost and complexity increase considerably

Engineering Contradiction:

Improveprocessing capabilityVSAvoidcleanroom complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple processing facilities with different cleanliness requirements into a single integrated cleanroom environment. The system merges wafer fabrication tools, assembly equipment, and packaging operations within one controlled space, eliminating the need for separate facilities while maintaining appropriate cleanliness levels for each process through localized clean zones and airflow management.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cleanroom design implements multi-functional processing stations that can perform multiple operations. The system uses universal tooling and equipment that can adapt to different processing requirements, allowing the same facility to handle both high-cleanliness wafer fabrication and lower-cleanliness assembly operations, thereby reducing overall facility complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If traditional cleanroom design with separate facilities is used, then processing capability is improved, but cost increases considerably

Engineering Contradiction:

Improveprocessing capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent consolidates multiple separate cleanroom facilities into one integrated environment, reducing total construction costs, operational expenses, and maintenance requirements. By combining wafer fabrication, assembly, and packaging operations in a single facility, the system eliminates redundant infrastructure while maintaining process capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The system transitions from horizontal expansion (multiple separate facilities) to vertical integration (multi-layered processing zones within one facility). Different cleanliness levels are stacked vertically or arranged in layered configurations, allowing efficient space utilization and reduced overall facility footprint and cost.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If traditional separate facilities are used for different processing steps, then processing capability is improved, but productivity decreases due to slower processing

Engineering Contradiction:

Improveprocessing capabilityVSAvoidprocessing speed

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent integrates wafer fabrication, assembly, and packaging operations into a continuous flow within a single cleanroom environment. This merging eliminates the need to transport wafers and devices between separate facilities, reducing handling time and enabling faster throughput while maintaining appropriate cleanliness levels for each process stage.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The system implements continuous processing where wafers move through fabrication, assembly, and packaging operations without interruption or lengthy transfer periods. The integrated cleanroom design enables uninterrupted workflow, keeping processing equipment continuously operational and maximizing productivity.

Inventive Principle:

Principle #20Continuity of useful action

Data Source

PatentUS11462437B2Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them

Publication Date: 2022.10.04 FLITSCH FREDERICK A

AI summary

The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.