Conductive Clip Flexible Leads High Current Interconnect
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Solution Overview
Problem
High current or high power semiconductor devices face challenges with complex and spaced-out wire bonds, leading to early solder crack failure and low board level reliability in ribbon or clip interconnect configurations.
Innovation Solution
An integrated circuit device with a conductive clip and flexible leads that loop back under the clip, providing a flexible and strong interconnection to a leadframe and printed circuit board, reducing solder joint failure and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If wire bonds are used to interconnect IC die with other components, then electrical connection is achieved, but device complexity and spacing requirements increase
Solution Approach 1:
The patent combines multiple interconnection functions into a single integrated clip structure. The clip merges the functions of mechanical support, electrical connection, and stress absorption that were previously distributed across multiple wire bonds and solder joints, thereby reducing device complexity while improving reliability
Solution Approach 2:
The clip is divided into distinct functional portions: a body portion for mechanical support, a contact portion for electrical connection, and an extended portion for stress absorption. This segmentation allows each portion to optimize its specific function, reducing overall complexity while enhancing solder joint reliability
2Power
If ribbon or clip interconnect is used to provide adequate current capacity, then current carrying capability is improved, but solder crack failure and low board level reliability occur
Solution Approach 1:
The extended portion of the clip acts as a pre-positioned stress absorber that cushions mechanical stresses before they reach the solder joints. This beforehand cushioning prevents stress concentration at critical solder joint locations, thereby preventing solder crack failure and improving board level reliability while maintaining high current carrying capability
Solution Approach 2:
The extended portion of the clip serves as an intermediary element between the rigid clip body and the solder joints. It mediates mechanical stresses by absorbing and distributing them, protecting the solder joints from direct stress exposure while allowing the clip to maintain its current carrying function
3Power
If multiple bond wires are used to carry high current load, then current capacity is achieved, but assembly complexity and spacing requirements increase
Solution Approach 1:
The clip consolidates multiple wire bond functions into a single monolithic structure that provides equivalent or superior current capacity. This merging eliminates the need for multiple separate interconnection elements, significantly reducing assembly complexity while maintaining high current capability
Solution Approach 2:
The clip structure performs multiple functions simultaneously: it provides mechanical support, establishes electrical connection, absorbs mechanical stress, and carries high current loads. This multi-functionality replaces what would otherwise require multiple separate components, reducing assembly complexity while achieving the required current capacity
Data Source
AI summary
An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the first surface. The IC device may further include a conductive clip including a first portion coupled to the second surface of the IC die, a second portion coupled to the first portion and extending laterally away from the IC die, and at least one flexible lead coupled to the second portion and looping back under the second portion toward the leadframe. Furthermore, a package may be over the leadframe, IC die, and conductive clip and have an opening therein exposing the at least one flexible lead.