Closed-Loop Liquid Cooling for Data Center Heat Dissipation
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Solution Overview
Problem
Current data center cooling methods, relying on air conditioning systems, are expensive and limited in capacity, struggling to efficiently handle the increasing heat generated by electronic components without compromising computing power.
Innovation Solution
A closed-loop cooling system that uses a liquid to absorb heat from electronic components and transfers it to ambient air outside the data center, preventing ambient air from entering the internal cooling area and reducing the load on air conditioning systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air conditioning systems are used to cool air in the data center, then electronic components can be cooled, but the cost increases and the system becomes limited in capacity
Solution Approach 1:
The patent divides the cooling system into two separate zones: a first area containing electronic components and a second area for heat dissipation. This segmentation allows independent control of cooling processes, enabling the system to handle more electronic components without overburdening the air conditioning system.
Solution Approach 2:
The patent introduces a liquid coolant as an intermediary substance that circulates between the electronic components and the heat dissipation area. The coolant absorbs heat from components and transfers it to the ambient air, decoupling the cooling load from the air conditioning system's direct capacity.
2Temperature
If air conditioning systems cool and recirculate air, then electronic components are cooled, but the system becomes expensive to operate
Solution Approach 1:
The patent extracts the heat dissipation function from the air conditioning system by using a separate barrier and liquid coolant system. This allows the air conditioning system to focus solely on cooling ambient air for the second area, reducing the overall energy burden and operating costs.
Solution Approach 2:
The liquid coolant system serves itself by continuously circulating through the barrier, absorbing heat from electronic components in the first area and releasing it in the second area. This self-contained loop reduces dependence on energy-intensive air conditioning recirculation.
3Productivity
If more electronic components are deployed to increase computing power, then computational capability improves, but the existing air conditioning system cannot handle the heat load
Solution Approach 1:
By segmenting the data center into distinct first and second areas with separate cooling mechanisms, the system can accommodate more electronic components in the first area without proportionally increasing the load on the air conditioning system, thus supporting higher computing power.
Solution Approach 2:
The patent employs a liquid coolant system (hydraulic principle) to transfer heat from electronic components to the ambient air. This liquid-based heat transfer mechanism is more efficient and scalable than air-based cooling, allowing the system to handle increased heat loads from additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools electronic components without the need for air conditioning to recirculate cooled air, allowing for increased computing power without overburdening the cooling system, while maintaining ambient air's cleanliness and temperature standards.
Implementation Method 1
The liquid moves in proximity to the electronic component 123, moves from the first area 121 into the second area 122 through the barrier 140 at location 141
Implementation Method 2
The first portion 131 of the closed loop 130 is configured for removing heat from the electronic component 123 that resides in the first area 121 and configured for moving the removed heat to the second area 122 using the liquid
Implementation Method 3
The barrier 140 is configured for physically separating the first area 121 and the second area 122. The barrier 140 restricts ambient air 170 to the second area 122 and prevents the ambient air 170 from entering the first area 121
Implementation Method 4
a pump 124 is used to move the liquid through the dosed loop 130. For example, the pump 124 causes cooled liquid to move through the closed bop 130
Data Source
AI summary
A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.