Cooling systems and methods
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Solution Overview
Problem
The electronics industry faces challenges in effectively managing heat dissipation in high-performance systems, such as microprocessors and servers, where traditional cooling methods often require secondary refrigeration systems and are not integrated into initial design phases, leading to inefficiencies and increased costs.
Innovation Solution
A low-pressure multiphase thermal regulation system is introduced, featuring a closed loop fluid flow path with a condenser, cooling interfaces, and a flow generator, which uses latent heat from phase transitions to efficiently cool electronic components by directing liquid coolant to vaporize and condense, thereby managing heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional refrigeration systems are used to cool electronic systems, then cooling capability is provided, but system complexity and cost increase due to secondary cooling systems added after manufacture
Solution Approach 1:
The patent integrates thermal management directly into the electronic device housing structure, merging the cooling function with the device itself rather than adding separate secondary cooling systems. The housing acts as both structural enclosure and thermal management component, eliminating the need for additional standalone cooling apparatus.
Solution Approach 2:
Thermal management features are built into the housing during the original manufacturing process rather than being added later. The housing is designed with integrated cooling channels, heat sinks, or phase change materials as part of the initial device construction, enabling thermal management to be considered from the outset rather than as an afterthought.
2Temperature
If traditional refrigeration systems are used, then cooling is provided, but maintenance costs and operational complexity increase
Solution Approach 1:
The integrated housing design incorporates passive thermal management features such as heat sinks, cooling fins, or phase change materials that automatically regulate temperature without requiring external refrigeration systems. This self-regulating approach eliminates the need for complex active cooling components that would require maintenance, filtering, or refrigerant management.
3Temperature
If cooling systems are added after manufacture, then thermal management is achieved, but design efficiency and cost-effectiveness decrease
Solution Approach 1:
The housing structure is designed to perform dual functions: providing structural enclosure and enabling thermal management. Cooling channels, heat dissipation features, or thermally conductive materials are integrated directly into the housing design, allowing simultaneous achievement of structural and thermal management objectives without separate components.
Solution Approach 2:
The housing serves multiple functions including mechanical protection, structural support, and active thermal management. By designing the housing to fulfill these diverse roles, the patent eliminates the need for separate dedicated cooling systems, reducing overall system complexity and manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides continuous, cost-effective thermal regulation, enhancing the efficiency and longevity of electronic devices by efficiently absorbing and dissipating heat, reducing the need for continuous coolant flow and minimizing maintenance costs.
Implementation Method 1
directing a liquid coolant from the first channel of the cooling system to the cooling interface to subject the liquid coolant to a phase transition to form a vapor coolant
Implementation Method 2
uses latent heat from phase transitions to efficiently cool electronic components by directing liquid coolant to vaporize and condense
Implementation Method 3
subjecting the vapor coolant to a phase transition to form the liquid coolant
Implementation Method 4
uses latent heat from phase transitions to efficiently cool electronic components by directing liquid coolant to vaporize and condense
Data Source
Figure 1A~1B
Figure 2~3
Figure 4A
AI summary
The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.