Closed-Path PCB Transformer for Compact Reinforced Isolation
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Solution Overview
Problem
High-quality galvanic isolation transformers are large and expensive, making them impractical for smaller footprint circuit designs like integrated circuits, while small isolation transformers have poor isolation ratings.
Innovation Solution
A transformer design featuring double-layered pre-impregnated isolation barriers and magnetic material with a closed magnetic path, which reduces flux leakage and increases inductance density, allowing for high isolation voltage and quality factor within a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire wound transformers are used to achieve high quality galvanic isolation, then isolation performance is improved, but device size and cost increase
Solution Approach 1:
The transformer is segmented into multiple functional layers including primary winding layers, secondary winding layers, and isolation barrier layers stacked in sequence. This segmentation allows each layer to perform its specific function efficiently while maintaining compact overall dimensions, resolving the contradiction between isolation performance and size.
Solution Approach 2:
The isolation barriers are nested within the transformer structure, positioned between the primary and secondary windings. This nesting approach integrates the isolation function directly into the transformer core structure rather than adding external isolation components, thereby maintaining high isolation performance while minimizing increased size.
2Reliability
If wire wound transformers are used to achieve high quality galvanic isolation, then isolation performance is improved, but device cost increases
Solution Approach 1:
The patent replaces traditional mechanical wire winding processes with printed circuit board (PCB) fabrication techniques. The windings are formed as conductive traces on PCB layers, and isolation barriers are created as insulating layers between PCB sections. This substitution dramatically reduces manufacturing complexity and cost while maintaining isolation performance.
Solution Approach 2:
The invention changes the manufacturing parameters from hand or automated wire winding to PCB lamination and etching processes. This parameter change enables mass production with consistent quality at lower cost, resolving the contradiction between isolation performance and manufacturing cost.
3Volume of moving object
If transformer size is reduced for smaller footprint circuit designs, then device size is improved, but isolation rating deteriorates
Solution Approach 1:
The transformer utilizes the third dimension (vertical stacking) to achieve isolation functionality. Multiple PCB layers are stacked with isolation barriers between them, creating a compact planar footprint while maintaining adequate isolation distance through vertical separation. This dimensional approach allows small footprint with high isolation rating simultaneously.
Solution Approach 2:
The patent employs composite construction combining conductive PCB traces, insulating PCB substrate materials, and additional isolation barrier materials. This composite structure achieves high isolation ratings in a compact form by leveraging the complementary properties of different materials working together in a layered configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves superior reinforced isolation, high inductance density, and quality factor, enabling efficient electrical isolation and interference shielding in a cost-effective and compact form suitable for integrated circuit packaging.
Implementation Method 1
an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element
Implementation Method 2
Galvanic isolation is the principle of isolating sections of circuits to prevent current flow between the sections
Implementation Method 3
a first inductive element disposed below the first isolation barrier and extending in the axial direction... a second inductive element disposed below the second isolation barrier and extending in the axial direction
Data Source
AI summary
A transformer respectively includes a first isolation barrier, a first inductive element, a second isolation barrier, and a second inductive element. The first isolation barrier and second isolation barrier each comprise multiple isolation layers. The transformer also includes magnetic material including a top magnetic portion disposed above the first isolation barrier. The transformer also includes a bottom magnetic portion disposed below the second inductive element; The transformer further includes an intermediary magnetic portion extending from the top magnetic portion to the bottom magnetic portion via a through-hole within the first isolation barrier, first inductive element, second isolation barrier, and second inductive element. The transformer yet further includes at least one lateral magnetic portion extending from the top magnetic portion to the bottom magnetic portion. The at least one lateral magnetic portion is disposed laterally from the first isolation barrier, first inductive element, second isolation barrier, and second inductive element.