CMOS Image Sensor Global Drive Layout for Uniform Exposure
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Solution Overview
Problem
CMOS image sensors face exposure time unevenness due to IR drop and wiring delays, leading to reduced image quality, especially in high-speed operations.
Innovation Solution
A solid-state imaging element with a global drive portion and a rolling drive portion, where the global drive circuit is placed on multiple sides of the pixel array region, reducing waveform rounding and ensuring uniform exposure time across all pixels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the global drive circuit is placed on one side of the pixel array region, then the device complexity is reduced, but exposure time unevenness increases due to IR drop and wiring delays
Solution Approach 1:
The global drive circuit is divided into multiple independent drive circuits positioned on different sides of the pixel array region. Each drive circuit independently drives a portion of the pixel array, which segments the current paths and reduces the cumulative effect of IR drop and wiring delays across the entire array, thereby improving exposure time uniformity.
Solution Approach 2:
Different regions of the pixel array are driven by locally positioned drive circuits. The drive circuits are strategically placed on multiple sides to provide localized driving, which reduces the distance that signals must travel and minimizes the impact of wiring delays and IR drop on exposure time uniformity across different regions.
2Manufacturing precision
If the global drive circuit is placed on multiple sides of the pixel array region, then exposure time uniformity is improved, but the device complexity increases
Solution Approach 1:
The global drive circuit is divided into multiple independent drive circuits positioned on different sides of the pixel array region. Each drive circuit independently drives a portion of the pixel array, which segments the current paths and reduces the cumulative effect of IR drop and wiring delays across the entire array, thereby improving exposure time uniformity.
Solution Approach 2:
Multiple drive circuits perform the same global shutter driving function but are distributed across different sides of the pixel array. This multi-functional arrangement allows each circuit to serve its local region while collectively achieving uniform exposure time across the entire array, balancing complexity with performance.
3Manufacturing precision
If the global drive circuit is placed on multiple sides of the pixel array region, then image quality is improved, but the manufacturing cost increases
Solution Approach 1:
The global drive circuit is divided into multiple independent drive circuits positioned on different sides of the pixel array region. Each drive circuit independently drives a portion of the pixel array, which segments the current paths and reduces the cumulative effect of IR drop and wiring delays across the entire array, thereby improving exposure time uniformity.
Solution Approach 2:
The patent changes the spatial distribution parameter of the drive circuits from a single-side configuration to a multi-side configuration. This parameter change improves image quality by reducing exposure time unevenness, and the cost increase is offset by the ability to use standard manufacturing processes for creating multiple identical circuit blocks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes exposure time unevenness, enabling higher image quality even in high-speed operations by distributing instantaneous current paths and ensuring all pixels are driven at the same timing.
Implementation Method 1
charges generated by photoelectric conversion in a photodiode
Data Source
AI summary
The present disclosure relates to a solid-state imaging element and an electronic apparatus that can achieve a higher image quality. The imaging element includes a pixel having a global drive portion in which all rows are driven at a same timing and a rolling drive portion in which each row is driven at a corresponding timing, a pixel array region in which a plurality of the pixels is placed in an array, a global drive circuit configured to supply a drive signal to the global drive portion, and a rolling drive circuit configured to supply a drive signal to the rolling drive portion. Further, the global drive circuit is placed on each of at least three or more sides of four sides surrounding the pixel array region. The present technology is applicable to a stacked CMOS image sensor, for example.


