CMOS X-ray Detector Scintillator Integration

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Solution Overview

Problem

Digital X-ray detectors, particularly CMOS-based systems, suffer from suboptimal performance due to protective materials on detachable scintillator plates that exhibit poor light transparency and reflection properties, leading to loss of useful light photons.

Innovation Solution

A digital X-ray detector design where the scintillator layer is directly deposited onto the CMOS light imager, with a reflective layer on the scintillator surface opposite the imager to redirect optical photons and a moisture blocking layer to prevent contamination, enhancing detective quantum efficiency (DQE).

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective material is coated on the detachable scintillator plate, then the scintillator plate is protected, but light transparency and light reflection properties deteriorate, causing loss of useful light photons

Engineering Contradiction:
Improveprotection of scintillator plateVSAvoidloss of light photons
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent removes the protective coating material from the scintillator plate surface, extracting the harmful element that caused light photon loss. By eliminating the protective coating, the scintillator plate surface directly contacts the CMOS light imager, ensuring optimal light transparency and reflection properties without energy loss.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the scintillator plate directly with the CMOS light imager by eliminating intermediate protective layers. This direct contact configuration combines the light-photon-generating scintillator plate with the light-photon-detecting CMOS sensor, maximizing light transmission efficiency and eliminating the protective coating's negative impact on optical performance.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of operation

If detachable scintillator plates are used, then the detector can be assembled and disassembled, but the protective materials on these plates exhibit poor light transparency and reflection properties

Engineering Contradiction:
Improvedetachability of scintillator plateVSAvoidloss of light photons
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The patent extracts and removes the protective coating material that caused optical performance degradation. By taking out this harmful protective layer, the scintillator plate maintains its detachability for ease of operation while eliminating the light photon loss associated with protective coatings.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the optical parameters of the scintillator plate interface by removing the protective coating. This parameter change transforms the interface from a coated surface with poor light transparency and reflection to a bare surface with optimal optical properties, while preserving the mechanical detachability of the scintillator plate.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional protective materials are used on scintillator plates, then the plates are protected from damage, but detective quantum efficiency decreases due to poor light transparency and reflection

Engineering Contradiction:
Improveprotection of scintillator plateVSAvoiddetective quantum efficiency
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent extracts and removes the protective coating material that degraded optical performance. By eliminating this coating, the scintillator plate maintains structural protection through alternative means while restoring optimal light transparency and reflection properties, thereby improving detective quantum efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a composite structure where the scintillator plate is directly coupled with the CMOS light imager without intermediate protective coatings. This composite configuration eliminates the optical interference caused by protective materials while maintaining system integrity through direct material contact between the scintillator and sensor layers.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves the detective quantum efficiency (DQE) of the X-ray detector by minimizing photon loss and maintaining high image quality, reducing quantum noise and enhancing overall performance.

Implementation Method 1

a scintillator layer configured to absorb radiation emitted from a radiation source and to emit optical photons in response to the absorbed radiation

Methodology Applied
Scientific EffectScintillation: Scintillation

Implementation Method 2

a reflective layer that is configured to reflect optical photons emitted by the scintillator towards the CMOS light imager

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 3

a complementary metal-oxide-semiconductor (CMOS) light imager having a photodetector layer configured to absorb the optical photons emitted by the scintillator layer

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS9063238B2Complementary metal-oxide-semiconductor X-ray detector
Publication Date: 2015.06.23 GE PRECISION HEALTHCARE LLC
  • US9063238B2 patent drawing
  • US9063238B2 patent drawing
  • US9063238B2 patent drawing

AI summary

In accordance with one embodiment, a digital X-ray detector is provided. The detector includes a scintillator layer configured to absorb radiation emitted from a radiation source and to emit optical photons in response to the absorbed radiation. The detector also includes a complementary metal-oxide-semiconductor (CMOS) light imager that is configured to absorb the optical photons emitted by the scintillator layer. The CMOS light imager includes a first surface and a second surface, and the first surface is disposed opposite the second surface. The scintillator layer contacts the first surface of the CMOS light imager.