CMP Polishing Pad Adhesive Resists Delamination
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Solution Overview
Problem
Adhesives used in chemical mechanical planarization (CMP) applications often fail due to delamination between intermediate layers of polishing pads, leading to productivity losses and downtime, as they are prone to failure under multidirectional forces and harsh chemical environments.
Innovation Solution
The development of an adhesive component with a modulus greater than 105 Pa at 25° C to 80° C and less than 105 Pa at temperatures above 100° C, incorporating high IR absorption components like carbon black, which facilitates improved heat transfer and resistance to chemical deterioration, is used in CMP polishing pads and transfer tapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If typical pressure sensitive adhesives are used in CMP stacked pads, then the adhesive provides initial bonding between pad layers, but the adhesive fails under multidirectional forces and harsh chemical environments causing delamination
Solution Approach 1:
The patent changes the chemical parameters of the adhesive by selecting polymers with specific glass transition temperatures (Tg) and chemical resistance properties. The adhesive composition is modified to include cross-linking agents and specific polymer blends that maintain flexibility while resisting chemical deterioration from CMP slurries, thereby resolving the contradiction between initial bonding capability and resistance to chemical deterioration.
Solution Approach 2:
The patent employs composite adhesive formulations combining multiple polymer types, cross-linking agents, and functional additives. This composite approach creates an adhesive system that simultaneously provides strong initial bonding, flexibility under stress, and enhanced chemical resistance, thereby addressing the contradiction between adhesive performance and chemical deterioration.
2Strength
If adhesive stiffness is increased to resist delamination forces, then adhesion strength improves, but the adhesive becomes too rigid to accommodate thermal expansion and stress during polishing
Solution Approach 1:
The patent creates a dynamic adhesive system where the polymer matrix can adapt its mechanical properties in response to environmental conditions. The adhesive formulation includes polymers with specific Tg ranges that allow the material to transition between rigid and flexible states based on temperature and stress conditions, enabling the adhesive to maintain both strength and flexibility during the polishing process.
Solution Approach 2:
The patent modifies the mechanical parameters of the adhesive by selecting polymers with specific glass transition temperatures and incorporating plasticizers or cross-linking agents in controlled amounts. This creates an adhesive with optimized balance between adhesion strength and flexibility, allowing it to resist delamination forces while accommodating thermal expansion and polishing stresses.
3Ease of operation
If the adhesive remains soft at operating temperatures to accommodate substrate thickness variations, then continuous pressure is maintained, but the adhesive cannot resist delamination under high stress
Solution Approach 1:
The patent utilizes the temperature-dependent mechanical properties of polymers by selecting materials with specific glass transition temperatures. The adhesive remains soft and compliant at operating temperatures to maintain continuous pressure on the substrate, while the cross-linked network structure provides enhanced strength and delamination resistance under high stress conditions, thereby resolving the contradiction between ease of operation and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive component provides enhanced adhesion and resistance to chemical and thermal stresses, preventing delamination and maintaining effectiveness in CMP processes, even under extreme conditions.
Implementation Method 1
incorporating high IR absorption components like carbon black, which facilitates improved heat transfer
Data Source
AI summary
Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.