Non-Macromolecular Adhesive Additives TRIZ Cases

A resin composition using maleimide and secondary monoamino compounds to achieve suitable viscosity and adhesiveness.

A microcapsule curable resin composition encapsulates thiol-based curing agents to deliver strong adhesive bonds on screw members.

Selective wavelength transmittance enables infrared crack detection through the film, concealing grinding marks from visual observation.

Core-shell polyisocyanate in aqueous adhesive prevents pinholes and yellowing, maintaining adhesion under hot humid conditions.

A silicone hybrid pressure sensitive adhesive composition cures to form a layer that adheres and conforms to uneven surfaces.

A room-temperature curable organosilicon composition uses an organotitanium catalyst to accelerate condensation curing.

Reaction product of epoxy resin and phenolic compound improves toughness without sacrificing heat resistance.

Polysilsesquioxane stabilizes particles in polysiloxane, eliminating organic dispersants that cause yellowing under light and heat.

Addition-curable silicone adhesive suppresses adhesive strength decrease upon re-attachment, reducing skin irritation.

A selectively-releasable adhesive blends a releasing compound with a base adhesive to lower bond strength upon agent application.

Adhesive tape embeds ferrite particles and high-conductivity fillers to enable induction heating without external sources, preventing substrate damage.

A silver nanopaste formulation uses short-chain organic coatings and thixotropic modifiers to enable smooth screen printing.

Removing amine compounds from the formulation resolves the contradiction between open time and curing speed while maintaining storage stability.

A cross-linkable composition uses a metal cation complexing agent to maintain conductivity without inhibiting the curing reaction.

An epoxy-based bonding layer with a photocationic initiator stabilizes the polarizer against iodine sublimation, keeping chrominance variation at 5.2 or less.

A surface protective film uses a urethane-acrylic adhesive layer to enable rapid removal from glass substrates.

Solvent-free hot-melt adhesive composition utilizes a specific tackifier to stabilize viscosity during heating.

A reinforcing film uses a photocurable adhesive layer to switch between peelable and bonded states.

A reactive hot-melt adhesive composition utilizes a functional group protection type silane coupling agent to enhance bonding.

A two-part adhesive composition cures rapidly at room temperature to bond metal, glass, or plastic substrates.

Titanate coupling agent enhances adhesive durability in photocationically polymerizable compositions.

A film-forming polymer adhesive combines polynitroso compounds to bond natural rubber directly to metal substrates.

Adhesive with variable modulus prevents delamination between intermediate layers under harsh chemical and thermal stresses.

A transparent solid glue formulation uses glycerol and propylene glycol to control drying time through volatile point differences.

Replacing toxic organotin catalysts and isocyanate groups, the sulfide-methylene linkage ensures rapid curing while preventing yellowing.

An adhesive coating composition for electrical steel sheets combines resin and inorganic nanoparticles to form a durable bonding layer.

Hexagonal boron nitride platelets in thermosetting polymers achieve high thermal conductivity and low dielectric constant without external heat sinks.

Mixed urethane acrylate oligomers create a low elastic conductive adhesive that prevents peeling on flexible wiring boards during rapid curing.

A chloroprene polymer latex formulation stabilizes adhesive compositions by controlling alkali metal cation levels.

An adhesive composition incorporating a beta-1,3-glucan derivative with 2.6 to less than 3.0 degree of substitution achieves high holding power under heat.

A barrier adhesive composition uses polyisobutylene resin with organically modified nanoclay and sorbent nanoparticles to form a protective film.

Composite propylene polymer and olefin copolymer deliver high adhesion strength across polypropylene nonwoven fabrics and polyethylene films.

Segmented adhesive rod uses a cleaning agent section to inactivate reactive groups, preventing equipment clogging during processing.

Fatty amide and carboxylate fatty acid particles stabilize waterborne adhesives, preventing slip agent migration and phase separation.

Silane-modified polyurethane resin prevents yellowing and eliminates mixing failures in industrial production.

A thermosetting composition uses photocuring and thermal curing to join precision device components.

Specific polyisocyanate functional groups suppress foaming and maintain tensile strength when mixing ratios deviate.

Vinyl-modified polyphenylene ether resin combines with organosilicon crosslinking agents to form a dense three-dimensional network structure.

Heat-curable polyurethane adhesive prevents air bubbles at high temperatures, ensuring display visibility.

Replacing petroleum solvents with vegetable oil-derived terpenes reduces VOC emissions while maintaining peel resistance and adhesion strength.

Aliphatic diisocyanate replaces aromatic isocyanates in PTMEG prepolymers to resolve insufficient modulus and elongation for coated fiber-reinforced plastics.

Removing polymerizable oligomers from the formulation prevents permanent staining on stone substrates while maintaining mechanical strength and adhesion.

A low-resistance conductive tape uses a nickel-plated copper metal layer and acid-free acrylic adhesive to maintain electrical conductivity.

A dual-resin composition balances low dielectric tangent and high mechanical strength through optimized functional group ratios.

Adhesive hydrogel resists alkaline liquefaction to ensure stable electrical conductivity for corrosion protection.

Reversible cycloalkene adhesives enable rapid disassembly of multi-material apparel for recycling.

A polyurethane adhesive composition uses specific polyols to maintain strong adhesion.

Selecting organic solvents with controlled vapor pressure prevents resin bleeding and void generation in multi-stacked semiconductor packages.