Underfill Resin Composition for Semiconductor Adhesion
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Solution Overview
Problem
Existing underfill materials for semiconductor devices face challenges such as rapid curing of radically polymerizable monomers, insufficient adhesion due to limited mobility of silane coupling agents, narrow application range, low connection stability, and high water absorption leading to degraded adhesion over time.
Innovation Solution
A resin composition comprising a maleimide compound and a secondary monoamino compound with a boiling point of 120° C. or more, along with optional components like an organic compound with acidic sites, inorganic fillers, and flexibility-imparting components, to enhance adhesiveness, viscosity, and flux activity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a radically polymerizable monomer is used as the main resin, then the underfill material cures quickly, but the silane coupling agent has insufficient mobility to form enough bonds with silanol groups on the chip surface, resulting in poor adhesion
Solution Approach 1:
The patent changes the chemical parameters of the resin system by replacing radically polymerizable monomers with epoxy compounds and carboxyl-group containing flux components. This parameter change allows the resin to maintain lower viscosity and higher mobility at curing temperatures, enabling the silane coupling agent to effectively bond with silanol groups on the chip surface while still achieving adequate curing speed through the epoxy-flux reaction system.
Solution Approach 2:
The patent creates a composite resin system combining epoxy compounds, carboxyl-group containing flux components, and silane coupling agents. This composite material approach allows each component to contribute its strengths: epoxy provides structural integrity and adhesion, flux components provide mobility and reactivity, and silane coupling agents provide chemical bonding to the chip surface, collectively resolving the contradiction between curing speed and adhesion.
2Productivity
If a pre-applied underfill material is used to improve filling efficiency, then productivity increases, but the material must maintain stability during storage without premature reaction
Solution Approach 1:
The patent applies the underfill material to the chip or substrate in advance before the bonding process. The resin composition is formulated with epoxy compounds and carboxyl-group containing flux components that remain stable during storage but become reactive under the specific temperature and pressure conditions of the bonding process, allowing preliminary application without premature curing.
Solution Approach 2:
The patent utilizes parameter changes in temperature and pressure during the bonding process to trigger the reaction between epoxy and flux components. During storage at ambient conditions, the reaction proceeds minimally, but during bonding at elevated temperatures, the reaction accelerates to achieve curing, thus maintaining both storage stability and reactivity when needed.
3Length of moving object
If the pitch between electrodes and gap between electrodes are reduced for downsizing, then device performance improves, but the underfill material filling process becomes more difficult with longer filling time and insufficient filling
Solution Approach 1:
The patent changes the viscosity and flow characteristics parameters of the underfill material by using epoxy compounds with appropriate molecular weights and carboxyl-group containing flux components. This formulation allows the material to maintain low viscosity at processing temperatures, enabling it to rapidly fill narrow gaps between closely-spaced electrodes without excessive filling time or insufficient filling.
4Reliability
If a maleimide resin with high water absorption is used, then the resin provides good initial adhesion, but adhesion degrades significantly after hygroscopic treatment
Solution Approach 1:
The patent replaces maleimide resin with a composite system of epoxy compounds and carboxyl-group containing flux components. This composite material approach provides good initial adhesion through epoxy-silane bonding while maintaining stability after hygroscopic treatment, as the epoxy-flux system is less susceptible to water-induced degradation compared to maleimide resins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent adhesiveness to semiconductor chips, suitable viscosity, and flexibility, improving the stability and productivity of underfill materials in flip-chip bonding applications.
Implementation Method 1
A resin composition comprising a maleimide compound (A) and a secondary monoamino compound (B)
Implementation Method 2
a resin composition comprising a maleimide compound and a secondary monoamino compound with a boiling point of 120° C. or more
Implementation Method 3
mobility of the mixed silane coupling agent in an adhesion portion is unavoidably controlled by a main resin that has been polymerized before forming a sufficient number of bonds with silanol groups present on a surface of the chip
Data Source
AI summary
The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120° C. or more.