Resin Composition for Printed Wiring Boards with Low Dielectric Tangent
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Solution Overview
Problem
Current resin compositions for printed wiring boards face challenges in achieving a balance of low dielectric tangent, high mechanical strength, and high adhesiveness, particularly under high-temperature and high-humidity conditions.
Innovation Solution
A resin composition combining a thermosetting resin with a radical polymerizable resin, along with a specific resin that reacts with both, optimizing the functional group ratios to form a cured product with reduced polarity and enhanced cross-linking density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a conventional resin composition is used, then the dielectric tangent can be reduced, but the mechanical strength and adhesiveness deteriorate
Solution Approach 1:
The patent employs a composite resin system combining thermosetting resin (epoxy, phenolic, or cyanate ester) with radical polymerizable resin (acrylic or methacrylic), where each component contributes different properties: the thermosetting resin provides mechanical strength and cross-linking, while the radical polymerizable resin reduces dielectric tangent through its low-polarity cured structure
Solution Approach 2:
The patent optimizes the compositional parameters by controlling the weight ratio of thermosetting resin to radical polymerizable resin within 95:5 to 50:50, and adjusts the functional group ratios (na: 0.01-200, nb: 0.01-400) to achieve the desired balance between dielectric properties and mechanical performance
2Object-generated harmful factors
If a conventional resin composition is used, then the dielectric tangent can be reduced, but the adhesiveness deteriorates
Solution Approach 1:
The dual-resin system creates a composite material where the thermosetting resin forms strong adhesive bonds through cross-linking reactions, while the radical polymerizable resin maintains low dielectric tangent, achieving both high adhesiveness and low dielectric properties simultaneously
Solution Approach 2:
The patent controls the functional group ratios na and nb within specific ranges to optimize the balance between adhesive bonding capacity and dielectric performance, ensuring sufficient cross-linking density for adhesion while maintaining low polarity for dielectric properties
3Object-generated harmful factors
If the resin composition is optimized for low dielectric tangent, then the polarity is reduced, but the cross-linking density and mechanical properties worsen
Solution Approach 1:
The patent divides the resin system into two functional segments: thermosetting resin responsible for cross-linking density and mechanical strength, and radical polymerizable resin responsible for reducing polarity and dielectric tangent, allowing each segment to perform its specialized function without compromising the other
Solution Approach 2:
The patent adjusts the weight ratios and functional group concentrations to achieve optimal cross-linking density while maintaining reduced polarity, using the synergistic interaction between the two resin types to overcome the trade-off between these properties
4Strength
If high mechanical strength is achieved through conventional means, then the cross-linking density is increased, but the dielectric tangent increases
Solution Approach 1:
The patent changes the chemical composition parameters by introducing radical polymerizable resin with low-polarity cured structures, allowing high cross-linking density to be achieved through thermosetting resin while the radical polymerizable resin component maintains low dielectric tangent through its molecular structure
Solution Approach 2:
The composite resin system allows decoupling of mechanical strength generation (through thermosetting cross-linking) from dielectric properties (maintained by radical polymerizable resin), enabling simultaneous achievement of high strength and low dielectric tangent
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a cured product with low dielectric tangent, high mechanical strength, and excellent adhesiveness, maintaining performance even under harsh environmental conditions.
Implementation Method 1
a resin having a thermosetting functional group FA, a resin having a radical polymerizable functional group FB, and a resin having a functional group FA′ reacting with the thermosetting functional group FA
Implementation Method 2
a resin having a radical polymerizable functional group FB
Data Source
AI summary
Provided is a resin composition that can provide a cured product of low dielectric tangent, high mechanical strength, and high adhesiveness. The resin composition contains (A) a resin having a thermosetting functional group FA, (B) a resin having a radical polymerizable functional group FB, and (C) a resin having a functional group FA′ reacting with the thermosetting functional group FA and a functional group FB′ reacting with the radical polymerizable functional group FB. A number na of the functional group FA′ of the component (C) when the number of the thermosetting functional group FA of the component (A) is defined as 1 and a number nb of the functional group FB′ of the component (C) when the number of the radical polymerizable functional group FB of the component (B) is defined as 1 satisfy 0.01≤na≤200 and 0.01≤nb≤400, respectively.